Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI045N10N3 G
MA000933836
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
8.861
0.851
0.255
849.682
10.366
5.758
109.401
460.637
15.198
0.228
0.001
0.429
1.074
2.791
0.032
0.106
106.210
Average
Mass
[%]
0.56
0.05
0.02
54.05
0.66
0.37
6.96
29.30
0.97
0.01
0.00
0.03
0.07
0.18
0.00
0.01
6.76
29. August 2013
1571.88 mg
Sum
[%]
0.56
Average
Mass
[ppm]
5637
541
162
54.12
0.66
540552
6595
3663
69599
36.63
0.97
293049
9668
145
0.01
0
273
683
0.28
1776
20
68
6.77
67569
67657
1000000
2732
145
366311
9668
541255
6595
Sum
[ppm]
5637
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com