Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP048N12N3 G
MA000742082
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
15.224
0.816
0.245
815.335
4.222
5.822
110.620
465.767
21.462
0.244
0.001
0.652
1.630
4.237
0.590
0.177
589.466
Average
Mass
[%]
0.75
0.04
0.01
40.04
0.21
0.29
5.43
22.87
1.05
0.01
0.00
0.03
0.08
0.21
0.03
0.01
28.94
29. August 2013
2036.51 mg
Sum
[%]
0.75
Average
Mass
[ppm]
7476
401
120
40.09
0.21
400359
2073
2859
54318
28.59
1.05
228708
10539
120
0.01
0
320
800
0.32
2081
290
87
28.98
289449
289826
1000000
3201
120
285885
10539
400880
2073
Sum
[ppm]
7476
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com