NICHIA STS-DA1-2751C <Cat.No.131107>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Junction Temperature
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
J
Absolute Maximum Rating
25
80
85
100
-30~85
-40~100
100
Unit
mA
mA
mA
mW
°C
°C
°C
* Absolute Maximum Ratings at T
A
=25°C.
* I
FP
conditions with pulse width
≤10ms
and duty cycle
≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
Radiant Flux
Peak Wavelength
Spectrum Half Width
* Characteristics at T
A
=25°C.
* Radiant Flux value as per CIE 127:2007 standard.
Symbol
V
F
Φ
e
λ
p
Δλ
Condition
I
F
=20mA
I
F
=20mA
I
F
=20mA
I
F
=20mA
Typ
3.4
4.0
365
12
Unit
V
mW
nm
nm
1
NICHIA STS-DA1-2751C <Cat.No.131107>
RANKS
Item
Forward Voltage
Radiant Flux
Peak Wavelength
* Ranking at T
A
=25°C.
* Forward Voltage Tolerance: ±0.05V
* Radiant Flux Tolerance: ±10%
* Peak Wavelength Tolerance: ±3nm
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
-
7
6
5
Ua
Rank
Min
2.9
5.34
3.78
2.67
360
Max
4.0
7.56
5.34
3.78
370
nm
mW
Unit
V
2
NICHIA STS-DA1-2751C <Cat.No.131107>
SOLDERING
• Recommended Hand Soldering Condition
Temperature
Soldering Time
Position
350°C Max
3sec Max
No closer than 3mm from
the base of the lead.
• Recommended Dip Soldering Condition
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
120°C Max
60sec Max
260°C Max
10sec Max
No closer than 3mm from
the base of the lead.
* Solder the LED no closer than 3mm from the base of the lead.
* Dip soldering/hand soldering must not be performed more than once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* When soldering, do not apply stress to the lead frame while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED cap
until the LEDs cool down to room temperature.
* In order to avoid damage on the cap during cutting and clinching the leads,
it is not recommended to solder the LEDs directly on customer PCB without any gap between the cap and the board.
If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or cap damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the cap.
* When it is necessary to clamp the LEDs to prevent soldering failure,
it is important to minimize the mechanical stress on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
* Consider factors such as the dip soldering temperature, hand soldering temperature, etc. when choosing the solder.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
4
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