CYStech Electronics Corp.
8Amp. Ultrafast Plastic Rectifiers
Spec. No. : C471F2
Issued Date : 2010.02.24
Revised Date :
Page No. : 1/4
MUR0860F2
Features
•
175℃ operating junction temperature
•
Glass passivated chip junction
•
Low leakage current
•
Low switching loss, high efficiency
•
High forward surge capability
•
Insulating package, insulating voltage=2500V AC
•
High temperature soldering guaranteed : 260℃/40s, 0.25”(6.35mm) from case
•
Pb-free lead plating package
I
F(AV)
V
RRM
I
FSM
trr
Tj
V
F(MAX)
8A
600V
100A
50ns
175°C
1.5V
Mechanical Data
•
Case: ITO-220AC molded plastic
•
Mounting Position: Any
•
Weight: 1.85 grams, 0.065 ounce approximately
•
Terminals: Pure tin plated, solderable per J-STD-002 and JESD22-B102
•
Epoxy: UL 94V-0 rate flame retardant
•
Mounting torque: 10 in.-lb. maximum
Equivalent Circuit
MUR0860F2
Outline
ITO-220AC
K
A
MUR0860F2
CYStek Product Specification
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified.
Spec. No. : C471F2
Issued Date : 2010.02.24
Revised Date :
Page No. : 2/4
resistive or inductive load.
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
trr
C
J
V
AC
T
stg
T
J
2500
-65
-65
50
+175
+175
Min.
Typ.
Max.
600
420
600
1.5
Parameter
Maximum Recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage at
I
F
=8A
Maximum Average forward rectified current @
T
C
=100℃
Non-repetitive peak forward surge current @
8.3ms single half sine wave superimposed on
rated load (JEDEC method)
V
R
=600 V, T
C
=25℃
Maximum instantaneous
reverse current at
V
R
=600 V, T
C
=125℃
Maximum reverse
I
F
=1A, V
R
=30V,
dI
F
/dt=100A/μs
recovery time
Typical junction capacitance @ f=1MHz and applied
4V reverse voltage
Isolation voltage from terminal to heatsink, t=1minute
Units
V
V
V
V
1.23
8
100
10
100
50
A
A
μA
ns
pF
V
℃
℃
Storage temperature range
Operating junction temperature range
Thermal Data
Parameter
Maximum Thermal Resistance, Junction-to-case
Maximum Thermal Resistance, Junction-to-ambient
Symbol
R
th,j-c
R
th,j-a
Value
5
60
Unit
°C/W
°C/W
Ordering Information
Device
MUR0860F2
Package
ITO-220AC
(RoHS compliant package)
Shipping
50 pcs / Tube, 40 Tubes/Box
MUR0860F2
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
9
Average Forward Current---Io(A)
8
7
6
5
4
3
2
1
0
0
25
50
75
100
125
150
175
Case Temperature---T
C
(℃)
100000
Instantaneous Forward Current---I
F
(mA)
Spec. No. : C471F2
Issued Date : 2010.02.24
Revised Date :
Page No. : 3/4
Forward Current vs Forward Voltage
10000
1000
100
Tj=150℃
Tj=25℃
10
resistive or inductive load
Pulse width=300μs,
1% Duty cycle
1
0
0.2
0.4
0.6
0.8
1
1.2
Forward Voltage---V
F
(V)
1.4
Reverse Leakage Current vs Reverse Voltage
100
Junction Capacitance vs Reverse Voltage
1000
Reverse Leakage Current---I
R
(μA)
10
Tj=125℃
1
Tj=75℃
Junction Capacitance---C
J
(pF)
100
0.1
Tj=25℃
0.01
Tj=25℃, f=1.0MHz
0.001
0
100
200
300
400
500
600
Reverse Voltage---V
R
(V)
10
0.1
1
10
100
Reverse Voltage---V
R
(V)
MUR0860F2
CYStek Product Specification
CYStech Electronics Corp.
ITO-220AC Dimension
Marking:
Spec. No. : C471F2
Issued Date : 2010.02.24
Revised Date :
Page No. : 4/4
Logo
Device Name
Date Code
1
2
K
A
Style: Pin
1.Cathode 2.Anode
2-Lead ITO-220AC Plastic Package
CYStek Package Code: F2
*: Typical
DIM
A
b
C
D
E
F
e
Inches
Min.
Max.
0.178
0.194
0.028
0.036
0.014
0.021
0.617
0.633
0.274
0.408
0.092
0.108
*0.200
Millimeters
Min.
Max.
4.53
4.93
0.71
0.91
0.36
0.53
15.67
16.07
6.96
10.36
2.34
2.74
*5.08
DIM
H1
J1
L
Φ1
b1
L1
K
Inches
Min.
Max.
0.256
0.272
0.101
0.117
0.487
0.503
0.117
0.133
0.045
0.055
0.088
0.104
0.122
0.138
Millimeters
Min.
Max.
6.50
6.90
2.56
2.96
12.37
12.77
2.98
3.38
1.15
1.39
2.23
2.63
3.10
3.50
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: Pure tin plated
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MUR0860F2
CYStek Product Specification
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