MA4SPS302
SURMOUNT
TM
PIN Diode
RoHS Compliant
Features
Surface Mount
No Wire Bonding Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Rev. V4
MA4SPS302
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Tech’s patented HMIC
TM
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical conic topology provides for
exceptional heat transfer from the active area. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold
INCHES
DIM
Min.
Max.
Min.
MM
Max.
A
B
C
0.052
0.020
0.004
0.018
0.014
0.056
0.024
0.006
0.020
0.016
1.321
0.508
0.102
0.457
0.356
1.422
0.610
0.152
0.508
0.406
Absolute Maximum Ratings
T
AMB
= 25°C (unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
( RF & DC )
Mounting Temperature
Absolute Maximum
600mA
| -100V |
-55°C to +125°C
-55 °C to +150°C
+175°C
800mW
+260°C for 30 seconds
D
E
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNT
TM
PIN Diode
RoHS Compliant
Electrical Specifications @ T
AMB
= +25°C
Symbol
C
T
C
T
1
Rev. V4
Conditions
-40V, 1MHz
-40V, 1GHz
10mA, 100MHz
10mA
-10µA
-70 V
Units
pF
pF
W
V
V
nA
°C/W
ns
Min
Typ
0.40
0.36
1.3
0.84
Max
0.45
1,3
R
S2,3
V
F
V
R
I
R
R
qJL
TL
4
2.2
1.00
-70
-100
100
125
460
1000
I
H
=1A, I
L
=10mA
+10mA / -6mA
1. Total Capacitance, C
T
, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance.
C
T
= C
J
(Junction Capacitance) + C
PAR
(Parasitic Capacitance)
2.
3
Series resistance R
S
is equivalent to the total diode resistance:
R
S
= R
J
(Junction Capacitance Junction Resistance) + R
O
(Ohmic Resistance)
R
S
and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package
with conductive silver epoxy.
Rs vs. Forward Current and Frequenc
y
3
0.600
C
T
vs. Reverse Voltage and Frequency
0.500
0V
500uA
2
1mA
2mA
-40V
0.400
-5V
0.300
1
10mA
50mA
0.200
0.100
0
0
100
200
300
400
500
600
700
800
900
1000
0.000
0
100
200
300
400
500
600
700
800
900
1000
Frequency (MHz)
Frequency (MHz)
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNT
TM
PIN Diode
RoHS Compliant
MA4SPS302 ADS SPICE Model
&
Schematic
Rev. V4
MA4SPS302 SPICE Model
PinDiodeModel
NLPINM1
Is=1.0E-14 A
Vi=0.0 V
Un=900 cm^2/V-sec
Wi=6.5 um
Rr=20 K Ohm
Cmin=0.40 pF
Tau=0.20 usec
Rs=0.1 Ohm
Cj0=0.50 pF
Vj=0.7 V
M=0.5
Fc=0.5
Imax=1.0E+6 A/m^2
Kf=0.0
Af=1.0
wBv=100 V
wPmax=0.8 W
Ffe=1.0
MA4SPS302 Schematic
Ls
Cp
Rp
Rvia
Rvia
_
Notes :
Rs = 2 * Rvia + Rp
+
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNT
TM
PIN Diode
RoHS Compliant
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Rev. V4
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses to the die . It is also not recommended to reflow solder by causing heat to
flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can
be visually inspected through the die after attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538
, “Surface Mounting Instructions“.
Application Note M541
“Bonding and Handling
Procedures for Chip Diode Devices” provides handling and assembly recommendations.
Ordering Information
The MA4SPS302 SURMOUNT are packaged in gel packs.
Part Number
Gel Pack
MA4SPS302
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
