Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP65R190CFDA
MA001001686
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
9.451
0.816
0.245
815.335
2.486
8.881
97.694
485.510
21.462
0.244
0.001
0.157
0.125
5.989
0.177
0.590
589.466
Average
Mass
[%]
0.46
0.04
0.01
40.00
0.12
0.44
4.79
23.82
1.05
0.01
0.00
0.01
0.01
0.29
0.01
0.03
28.91
29. August 2013
2038.63 mg
Sum
[%]
0.46
Average
Mass
[ppm]
4636
400
120
40.05
0.12
399940
1219
4357
47922
29.05
1.05
238155
10528
120
0.01
1
77
62
0.31
2938
87
290
28.95
289148
289525
1000000
3077
120
290434
10528
400461
1219
Sum
[ppm]
4636
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com