Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC836MT-2FRA AB
MA001002908
PG-TSSOP-28-12
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
silver
gold
nickel
palladium
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-22-4
7440-57-5
7440-02-0
7440-05-3
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.495
0.056
0.243
1.120
35.909
0.374
0.191
8.092
55.432
0.003
0.005
0.094
0.003
0.310
1.238
Average
Mass
[%]
4.18
0.05
0.23
1.04
33.38
0.35
0.18
7.52
51.54
0.00
0.00
0.09
0.00
0.29
1.15
29. August 2013
107.56 mg
Sum
[%]
4.18
Average
Mass
[ppm]
41791
521
2256
10411
34.70
0.35
333834
3475
1777
75228
59.24
515339
26
48
875
0.09
30
2878
1.44
11511
14389
1000000
979
592344
347022
3475
Sum
[ppm]
41791
wire
encapsulation
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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