EEPROM, 64KX8, Serial, CMOS, PDSO8
参数名称 | 属性值 |
Objectid | 108462690 |
包装说明 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
数据保留时间-最小值 | 50 |
耐久性 | 500000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 |
内存密度 | 524288 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
端子数量 | 8 |
字数 | 65536 words |
字数代码 | 64000 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
电源 | 2/5 V |
认证状态 | Not Qualified |
串行总线类型 | I2C |
最大待机电流 | 0.000001 A |
最大压摆率 | 0.003 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
写保护 | HARDWARE |
S524AE0XH1-RIT | S524AE0XH1-RCT | S524AE0XH1-RCU | S524AE0XH1-RIU | |
---|---|---|---|---|
描述 | EEPROM, 64KX8, Serial, CMOS, PDSO8 | EEPROM, 64KX8, Serial, CMOS, PDSO8 | EEPROM, 64KX8, Serial, CMOS, PDSO8 | EEPROM, 64KX8, Serial, CMOS, PDSO8 |
Objectid | 108462690 | 108462687 | 108462686 | 108462689 |
包装说明 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
数据保留时间-最小值 | 50 | 50 | 50 | 50 |
耐久性 | 500000 Write/Erase Cycles | 500000 Write/Erase Cycles | 500000 Write/Erase Cycles | 500000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 |
端子数量 | 8 | 8 | 8 | 8 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
最低工作温度 | -40 °C | -25 °C | -25 °C | -40 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
封装等效代码 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | I2C | I2C | I2C | I2C |
最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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