REVISIONS
LTR
C
D
DESCRIPTION
Convert to military drawing format. Add vendor CAGE 18714.
Add case outline 2 (square chip carrier package) for vendor CAGE 27014.
Remove vendor from case A and add case D. Devices 01CX and 012X
inactive for new design. Use M38510/65201BCX and M38510/65201B2X.
Change code ident. no. 67268. Editorial changes throughout.
Add vendor CAGE 18324 for device types 01CX, 01DX and 012X. Figure 3:
Switching waveforms change output waveform to proper symbol. Editorial
changes throughout.
Add vendor CAGE F8859. Add class V device criteria. Editorial changes
throughout. -ljs
Correct data limits in paragraph 1.3 and test conditions in Table I. Correct
truth table. Add case outline X. Add Table III, delta limits. Editorial changes
throughout. -ljs
Correct table II. Update boilerplate to MIL-PRF-38535 requirements. – jak
DATE (YR-MO-DA)
87-01-19
88-03-22
APPROVED
M. A. Frye
M. A. Frye
E
89-02-16
M. A. Frye
F
99-11-04
Raymond Monnin
G
00-07-12
Raymond Monnin
H
02-02-08
Thomas M. Hess
Current CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Jeffery Tunstall
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
10
H
11
H
12
H
13
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Ray Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
84-05-16
REVISION LEVEL
H
MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, QUAD
2-INPUT OR GATE, MONOLITHIC SILICON
SIZE
CAGE CODE
A
SHEET
14933
1
OF
13
84045
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E203-02
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
84045
01
C
X
Drawing number
For device class V:
5962
-
Device type
(see 1.2.2)
Case outline
(see 1.2.4)
Lead finish
(see 1.2.5)
84045
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54HC32
Circuit function
Quad 2-input OR gate
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
84045
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
C
D
2
X
Descriptive designator
GDFP5-F14 or CDFP6-F14
GDFP4-F14
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
CDFP3-F14
Terminals
14
14
14
14
20
14
Package style
Flat pack
Flat pack
Dual-in-line
Flat pack
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A
for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
)..................................................................................
DC input voltage range (V
IN
)................................................................................
DC output voltage range (V
OUT
)...........................................................................
Input clamp diode current (I
IK
) .............................................................................
Output clamp diode current (I
OK
) ........................................................................
Continuous output current ..................................................................................
Continuous current through V
CC
or GND ............................................................
Storage temperature range (T
STG
).......................................................................
Maximum power dissipation (P
D
):........................................................................
Lead temperature (soldering, 10 seconds)..........................................................
Thermal resistance, junction-to-case (θ
JC
) ..........................................................
Junction temperature (T
J
) ....................................................................................
1.4 Recommended operating conditions. 2/ 3/
Supply voltage range (V
CC
)..................................................................................
Case operating temperature range (T
C
) .............................................................
Input rise or fall time (t
r
, t
f
):
V
CC
= 2.0 V ........................................................................................................
V
CC
= 4.5 V ........................................................................................................
V
CC
= 6.0 V ........................................................................................................
+2.0 V dc to +6.0 V dc
-55°C to +125°C
0 to 1,000 ns
0 to 500 ns
0 to 400 ns
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+0.5 V dc
-0.5 V dc to V
CC
+0.5 V dc
±20
mA
±20
mA
±25
mA
±50
mA
-65°C to +150°C
500 mW 4/
+260°C
See MIL-STD-1835
+175°C 5/
1/
2/
3
4/
5/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise specified, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of
-55°C to +125°C.
For T
C
= +100°C to +125°C, derate linearly at 12 mW/°C.
Maximum junction temperature shall not be exceeded except for allowable short circuit duration burn-in screening
conditions in accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
84045
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
84045
SHEET
4
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking
for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
group number 36 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
H
84045
SHEET
5
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