REVISIONS
LTR
DESCRIPTION
DATE
(YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
15
16
17
18
REV
SHEET
PREPARED BY
Gary L. Gross
19
20
21
22
1
2
3
4
5
6
7
8
9
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12
13
14
PMIC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Jeff Bowling
APPROVED BY
Raymond Monnin
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION-
HARDENED, 32K x 8-BIT MASK PROGRAMMABLE ROM,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
97-05-30
SIZE
REVISION LEVEL
CAGE CODE
A
SHEET
1
67268
OF
22
5962-97517
AMSC N/A
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E167-97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
R
97517
01
Q
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types shall identify the circuit function as follows:
Device type
01
02
Generic number 1/
6656
6656
Circuit function
32K X 8-bit radiation hardened mask PROM
32K X 8-bit radiation hardened mask PROM
Input buffer type
CMOS
TTL
Access time
40 ns
40 ns
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
CDIP2-T28
See figure 1
See figure 1
Terminals
28
28
36
Package style
Dual-in-line package
Flat package
Flat package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or
MIL-PRF-38535, appendix A for device class M.
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this
document and will also be listed in QML-38535 and MIL-HDBK-103 (see 6.6.2 herein).
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-97517
SHEET
2
1.3 Absolute maximum ratings. 2/
Supply voltage range (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage on any pin with respect to ground . . . . . . . . . . . . . . . . .
DC output current (IOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds maximum) . . . . . . . .
Thermal resistance, junction-to-case (
JC): Case X . . . . . . . .
Case Y and Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended operating conditions.
Supply voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ground voltage (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case operating temperature range (TC) . . . . . . . . . . . . . . . . . .
Radiation features:
Total dose irradiation, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single event phenomenon (SEP) effective
linear energy threshold (LET) with no upsets . . . . . . . . . . . .
Neutron irradiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . .
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
MILITARY
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Microcircuit Case Outlines.
+4.5 V dc to +5.5 V dc
0.0 V dc
-55
C to +125
C
> 1 x 106 Rads(Si)
> 120 MEV-cm2/mg
1 x 1014 neutrons/cm2 3/
-0.5 V dc to +7.0 V dc
-0.5 V dc to VDD +0.5 V dc
25 mA
2.5 W
+270
C
See MIL-STD-1835
2.0
C/W
+175
C
-65
C to +150
C
10 years (minimum)
as specified in the altered item drawing (AID)
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ Guaranteed, but not tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-97517
SHEET
3
HANDBOOKS
MILITARY
MIL-HDBK-103
MIL-HDBK-780
- List of Standard Microcircuit Drawings (SMD's).
- Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless
otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the
solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in
the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-88
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916 Race
Street, Philadelphia, PA 19103.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard No. 17
-
A Standardized Test Procedure for the Characterization of
Latch-up in CMOS Integrated Circuits.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Blvd., Arlington, VA 22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535
and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in
accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table for unprogrammed devices shall be as specified on figure 3.
3.2.4 AC test circuit and timing characteristics. The ac test circuit and timing characteristics shall be as specified on figure 4.
3.2.5 Read cycle waveforms. The read cycle waveforms shall be as specified on figure 5.
3.3.6 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 6.
3.2.7 Pin function descripton. See 6.5.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-97517
SHEET
4
3.2.8 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be
done for initial characterization and after any design or process changes which may affect data retention. The methods and
procedures may be vendor specific but shall guarantee data retention as specified in paragraph 1.3 over the full military temperature
range. The vendor's procedure shall be kept under document control and shall be made available upon request of the aquiring or
preparing activity, along with test data.
3.3 AID requirements. All AID's written against this SMD shall be sent to DSCC-VAS. The following items shall be provided to
the device manufacturer by the customer as part of an AID. These items form a part of the manufacturer's design
database/database archive and shall be maintained under document revision level control of the device manufacturer's Technology
Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. As such, these items will not appear in the AID in the traditional sense.
3.3.1 ROM mask definition. To generate a mask for a ROM code, an ASCII file shall be submitted. The format for the code shall
be as follows:
a. Two fields, address followed by data in hexadecimal code, most significant bit to least significant bit (AH is most significant
bit).
b. Addresses need not be in order.
c. Address and data fields must be separated by at least one space or a slash "/".
d. A semicolon ";" may terminate the line, but is not required.
e. No "end-of-file" characters are required.
f. Comments are preceded by the pound sign "#".
g. Comments may be on the same line
AFTER
address and data fields.
h. Unused locations do not need to be addressed, but
MUST
be specified as all zeroes or all ones. This can be done as a
comment.
3.3.2 Fault coverage measurement of manufacturing logic tests.
3.3.3 Burn-in circuit.
3.3.4 Radiation exposure circuit.
3.3.5 Maximum device cross section for SEP.
3.3.6 Programmed devices. The truth table for final masked (programmed) devices shall as specified in the altered item drawing.
3.4 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified, the electrical
performance characteristics, and postirradiation parameter limits are as specified in table I and shall apply over the full case
operating temperature range.
3.5 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests
for each subgroup are defined in table I.
3.6 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M
shall be in accordance with MIL-PRF-38535, appendix A.
3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316-5000
DESC FORM 193A
JUL 94
A
REVISION LEVEL
5962-97517
SHEET
5
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