®
SM15T6V8A/220A
SM15T6V8CA/220CA
TRANSIL
TM
FEATURES
s
s
s
s
s
s
PEAK PULSE POWER : 1500 W (10/1000µs)
BREAKDOWN VOLTAGE RANGE :
From 6.8 V to 220 V
UNI AND BIDIRECTIONAL TYPES
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGNIZED
DESCRIPTION
Transil diodes provide high overvoltage protection
by clamping action. Their instantaneous
response to transient overvoltages makes them
particularly suited to protect voltage sensitive
devices such as MOS Technology and low
voltage supplied IC’s.
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25°C)
Symbol
P
PP
P
I
FSM
Parameter
Peak pulse power dissipation (see note1)
Power dissipation on infinite heatsink
Non repetitive surge peak forward
current for unidirectional types
Storage temperature range
Maximum junction temperature
Maximum lead temperature for soldering during 10 s.
Tj initial = T
amb
T
amb
= 50°C
tp = 10ms
Tj initial = T
amb
Value
1500
6.5
200
Unit
W
W
A
SMC
T
stg
T
j
T
L
- 65 to + 175
150
260
°C
°C
°C
Note 1
: For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES
Symbol
R
th (j-l)
R
th (j-a)
Junction to leads
Junction to ambient on printed circuit on recommended pad
layout
Parameter
Value
15
75
Unit
°C/W
°C/W
September 2001 Ed : 3B
1/5
SM15Txx
ELECTRICAL CHARACTERISTICS
(T
amb
= 25°C)
Symbol
V
RM
V
BR
V
CL
I
RM
I
PP
V
F
Parameter
Stand-off voltage
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Peak pulse current
Voltage temperature coefficient
Forward Voltage drop
I PP
VCL
VBR
V RM
VF
I RM
V
I
IF
α
T
I
RM
@ V
RM
Types
Uni
Mar-
directional
king
SM15T6V8A MDE
SM15T7V5A MDG
SM15T10A
SM15T12A
SM15T15A
SM15T18A
SM15T22A
SM15T24A
SM15T27A
SM15T30A
SM15T33A
SM15T36A
SM15T39A
SM15T68A
SM15T75A
MDP
MDT
MDX
MEE
MEK
MEM
MEP
MER
MET
MEV
MEX
MFP
MFO
Bi
directional
SM15T6V8CA
SM15T10CA
SM15T12CA
SM15T15CA
SM15T18CA
SM15T22CA
SM15T24CA
SM15T27CA
SM15T30CA
SM15T33CA
SM15T36CA
SM15T39CA
SM15T68CA
SM15T75CA
SM15T100CA
SM15T150CA
SM15T200CA
Mar-
king
BDE
BDP
BDT
BDX
BEE
BEK
BEM
BEP
BER
BET
BEV
BEX
BFP
BFO
BFX
BGK
BGV
V
BR
min
@
I
R
V
CL
@ I
PP
max
10/1000µs
mA
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
V
10.5
11.3
14.5
16.7
21.2
25.2
30.6
33.2
37.5
41.5
45.7
49.9
53.9
92
103
137
207
274
A
143
132
103
90
71
59.5
49
45
40
36
33
30
28
16.3
14.6
11
7.2
5.5
V
CL
@ I
PP
max
8/20µs
V
13.4
14.5
18.6
21.7
27.2
32.5
39.3
42.8
48.3
53.5
59.0
64.3
69.7
121
134
178
265
353
A
746
690
538
461
368
308
254
234
207
187
169
156
143
83
75
56
38
28
αT
C
max
µA
1000
500
V
5.8
6.4
nom max
note2
V
6.8
7.5
10
12
15
18
22
24
27
30
33
36
39
68
-
100
150
200
V
7.14
7.88
10.5
12.6
15.8
18.9
23.1
25.2
28.4
31.5
34.7
37.8
41.0
71.4
78.8
105
158
210
max typ
note3 note4
10
-4
/°C
5.7
6.1
7.3
7.8
8.4
8.8
9.2
9.4
9.6
9.7
9.8
9.9
10.0
10.4
10.5
10.6
10.8
10.8
pF
9500
8500
7000
6000
5000
4300
3700
3500
3200
2900
2700
2500
2400
1550
1450
1150
850
675
V
6.45
7.13
9.5
11.4
14.3
17.1
20.9
22.8
25.7
28.5
31.4
34.2
37.1
64.6
71.3
95.0
143
190
SM15T7V5CA BDG
10 8.55
5 10.2
1 12.8
1 15.3
1 18.8
1 20.5
1 23.1
1 25.6
1 28.2
1 30.8
1 33.3
1 58.1
1 64.1
1 85.5
1 128
1 171
SM15T100A MFX
SM15T150A MGK
SM15T200A MGV
SM15T220A MGX
SM15T220CA
BGX
1 188
209
220
231
1
328
4.6
388
26
10.8
625
% I
PP
100
10 s
Fig. 1:
Peak pulse power dissipation versus initial
junction temperature (printed circuit board).
PULSE WAVEFORM 10/1000 s
50
0
1000 s
t
Note 2 :
Note 3 :
Note 4 :
Pulse test: tp < 50 ms.
∆V
BR =
αT
* (Tamb - 25) * VBR(25°C).
VR = 0 V, F = 1 MHz. For bidirectional types,
capacitance value is divided by 2.
2/5
SM15Txx
Fig. 2 :
Peak pulse power versus exponential pulse duration.
Fig. 3 :
Clamping voltage versus peak pulse current.
Exponential waveform t
p
= 20
µs
t
p
= 1 ms ——————-
t
p
= 10 ms ...............
Note :
The curves of the figure 3 are specified for a junction temperature of 25
⊃C
before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆V
BR
=
αT
*
[T
amb
-25]
*
V
BR
(25°C).
For intermediate voltages, extrapolate the given results.
3/5
SM15Txx
Fig. 4a :
Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 4b :
Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 5 :
Peak forward voltage drop versus peak
forward current (typical values for unidirectional
types).
Fig. 6 :
Transient thermal impedance junc-
tion-ambient versus pulse duration.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 7 :
Relative variation of leakage current
versus junction temperature.
4/5
SM15Txx
ORDER CODE
SM 15 T 100
SURFACE MOUNT
1500 WATT
C A
BIDIRECTIONAL
BREAKDOWN VOLTAGE
MARKING :
Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
PACKAGE MECHANICAL DATA
SMC (Plastic)
DIMENSIONS
E1
REF.
A1
A2
b
c
E
A1
Millimeters
Min.
Max.
2.45
0.20
3.2
0.41
8.15
7.15
4.70
6.25
1.60
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
Inches
Min.
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
D
E
E1
C
L
A2
E2
b
E2
D
L
Weight
= 0.25 g.
FOOTPRINT DIMENSIONS
(Millimeters)
SMC
3.3
Packaging
: standard packaging is in tape and reel.
2.0
4.2
2.0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2001 STMicroelectronics - Printed in Italy - All rights reserved.
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