Leiterplatten-Layout Vorschlag für SMT
PCB-Layout Proposal for SMT
1,2
1,6
-0,03
2
±0,05
a25
0,8
a1
7,6
2,2
0,3
Verpackt im Gurt nach DIN IEC 60286-3
Tape on Reel Packaging according to DIN IEC 60286-3
Verpackungseinheit: 560 Stück
Packaging unit: 560 pcs
1,27
1,27
24 x 1,27 = 30,48
34,9
±0,03
2,21
±0,03
330
Abspulrichtung -
Reel off Direction
9,6
7,2
1,5
-0,03
5,2
7,2
b1
b25
b1
0,75
-0,05
34,9
±0,03
32,5
3,85
56
Anforderungsstufe 1
1,27
Performance Level 1
Kontaktbereich vergoldet
3,05
Mating Area gold plating
1,55
1,27
24 x 1,27 = 30,48
33,5
36,83
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Anschlussbereich verzinnt 4-6 µm
Terminal Area 4-6 µm tin plating
Koplanarität der Anschlüsse
16
Coplanarity Area of Termination
≤
0,1 mm
≤
0,1 mm
BA7-03 - Standard Bauhöhe
type7-03 - Standard Assembly Height
Information:
Tolerances
All Dimensions
in mm
Scale
3:1
1,5
1
All rights reserved.
Only for Information.
To ensure that this is the latest
version of this drawing, please
contact one of the ERNI companies
before using.
g
Index
23.04.2014
Date
3,27
Designation
Subject to modification without
prior notice.
Drawing will not be updated.
Federl. SMC-Q 50-SMD-BA7-03
2
Female SMC-Q 50-SMD-type7-03
www.ERNI.com
Class
100500280001
SMCQ
K
A3
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