05051
SM16LC03
thru
Only One Name Means ProT
ek’Tion™
SM16LC36C
LOW CAPACIT
ANCE TVS ARRA
Y
APPLICA
TIONS
✔
Wireless Communication Circuits
✔
RS-422, RS-432 & RS-485
✔
Low Voltage ASICs
✔
Ethernet - 10/100 Base T
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
✔
61000-4-5 (Surge): 12A, 8/20µs Level 1 (Line-Ground) & Level 2 (Line-Line)
FEA
TURES
✔
500 Watts Peak Pulse Power per Line (tp=8/20µs)
✔
Unidirectional & Bidirectional Configuration
✔
ESD Protection > 40 kilovolts
✔
Available in Multiple Voltage Types: 3.3V to 36V
✔
Protects Up to Eight (8) Lines
✔
LOW CAPACITANCE: 15pF
✔
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
✔
✔
✔
Molded JEDEC SO-16 Package
Weight 0.15 grams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔
Flammability rating UL 94V-0
✔
16mm Tape and Reel Per EIA Standard 481
✔
Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package
SO-16
PIN CONFIGURA
TIONS
16
15
14
13
12
11
10
9
UNIDIRECTIONAL
CONFIGURATION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
BIDIRECTIONAL
CONFIGURATION
1
2
3
4
5
6
7
8
05051.R10 4/05
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SM16LC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
Forward Voltage @ 50mA, 300µs - Square Wave (Note 1)
Soldering Temperature for 10 seconds
Note 1:
Only applies to unidirectional devices.
SYMBOL
P
PP
T
J
T
STG
V
F
T
L
VALUE
500
-55°C to 150°C
-55°C to 150°C
1.5
265
UNITS
Watts
°C
°C
Volts
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(Notes 1 & 2)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1 A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ 8/20µs
V
C
@ I
PP
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
µA
MAXIMUM TEMPERATURE
CAPACITANCE COEFFICIENT
OF V
(BR)
@ 0V, 1 MHz
C
pF
θV
(BR)
mV/°C
V
WM
VOLTS
SM16LC03
SM16LC03C
SM16LC05
SM16LC05C
SM16LC08
SM16LC08C
SM16LC12
SM16LC12C
SM16LC15
SM16LC15C
SM16LC24
SM16LC24C
SM16LC36
SM16LC36C
3.3
3.3
5.0
5.0
8.0
8.0
12.0
12.0
15.0
15.0
24.0
24.0
36.0
36.0
4.5
4.5
6.0
6.0
8.5
8.5
13.3
13.3
16.7
16.7
26.7
26.7
40.0
40.0
7.0
7.0
9.8
9.8
13.4
13.4
19.0
19.0
25.5
25.5
40.0
40.0
53.0
53.0
20.0V @ 35A
20.0V @ 35A
24.0V @ 42A
24.0V @ 42A
26.0V @ 30A
26.0V @ 30A
33.0V @ 21A
33.0V @ 21A
39.0V @ 15A
39.0V @ 15A
57.0V @ 10A
57.0V @ 10A
72.0V @ 7.0A
72.0V @ 7.0A
125
125
20
20
10
10
2
2
2
2
2
2
2
2
15
15
15
15
15
15
15
15
15
15
15
15
15
15
-3
-3
3
3
9
9
16
16
17
17
26
26
36
36
Note 1:
Part numbers with a “C” suffix are bidirectional devices, i.e., SM16LC05C.
Note 2:
Unidirectional Devices Only:
Do not surge from pins 16 to 1, 15 to 2, 14 to 3, 13 to 4, 12 to 5, 11 to 6, 10 to 7 and 9 to 8. PIV typically
greater than 100V for each rectifier diode.
05051.R10 4/05
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SM16LC36C
GRAPHS
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
I
PP
- Peak Pulse Current - % of I
PP
10,000
P
PP
- Peak Pulse Power - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
500W 8/20µs Waveform
e
-t
100
t
d
= t I /2
PP
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
FIGURE 3
POWER DERATING CURVE
100
80
% Of Rated Power
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SM16LC05
40
Peak Pulse Power
8/20µs
5 Volts per Division
30
60
20
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
10
0
ESD Test Pulse: 25 kilovolt, 1/30ns (waveform)
FIGURE 5
INSERTION LOSS - SM16LC12
FIGURE 6
RETURN LOSS - SM16LC12
20 db
10 db per Division
10 db per Division
20 db
Ref 0 db
Ref 0 db
-20 db
-20 db
-50 db
100 MHz per Division
05051.R10 4/05
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-50 db
100 MHz per Division
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SM16LC36C
APPLICA
TION NOTE
The SM16LC & SM16LCxxC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD, EFT and other types of
surges. This product series provides both unidiretional and bidirectional protection, with a surge capability of 500 Watts P
PP
per line for an 8/20µs
waveform and ESD protection > 40kV.
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
Ideal for RS-485 applications, the SM16LCxxC Series provides up to eight (8) lines of protection in a common-mode configuration as depicted in
Figure 1. This low capacitance series allows the transceiver or telecommunications circuit to operate safely without significant signal distortion.
Circuit connectivity is as follows:
✔
Lines 1 is connected to Pin 9.
✔
Line 2 is connected to Pin 10.
✔
Line 3 is connected to Pin 11.
✔
Line 4 is connected to Pin 12.
✔
Line 5 is connected to Pin 13.
✔
Line 6 is connected to Pin 14.
✔
Line 7 is connected to Pin 15.
✔
Line 8 is connected to Pin 16.
✔
Pins 1-8 are connected to ground.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
LINE 5
Figure 1. Birectional Common-Mode Protection
TRANSCEIVER
D
LINE 1
LINE 2
LINE 3
D
LINE 4
Circuit board layout is critical for Electromagnetic Compatibil-
ity (EMC) protection. The following guidelines are recom-
mended:
✔
The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground loops
should be minimized.
R
LINE 6
LINE 7
R
LINE 8
16
15
14
13
12
11
10
9
✔
✔
✔
✔
1
2
3
4
5
6
7
8
The transient current return path to ground should be
kept as short as possible to reduce parasitic inductance.
Ground planes should be used whenever possible. For
multilayer PCBs, use ground vias.
05051.R10 4/05
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SM16LC36C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
-A-
SO-16
16
9
-B- P
1
8
0.010” (0.25 MM)
M
B
M
8 PL
PACKAGE DIMENSIONS
DIM
MILLIMETERS
MIN
MAX
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
5.80
0.25
INCHES
MIN
MAX
G
C
0º - 7º
-T-
K
16 PL
0.010” (0.25 MM)
M
T B
S
M
R X 45º
D
A
S
F
J
A
B
C
D
F
G
J
K
P
R
NOTES
0.393
10.00
0.386
4.00
0.150
0.157
0.068
1.75
0.054
0.014
0.019
0.49
1.25
0.016
0.049
1.27 BSC 0.05 BSC 0.05 BSC
0.25
0.008
0.009
0.009
0.25
0.004
0.229
0.244
6.20
0.50
0.010
0.019
MOUNTING PAD
0.050” TYP
0.030”
±
0.005”
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold
protrusions.
4. Maximum mold protrusion is 0.015” (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
0.160”
±
0.005”
0.245” MIN
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape,
i.e.,
SM16LC05-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape,
i.e.,
SM16LC05-T13.
4. Suffix - LF = Lead-Free, Pure-Tin Plating,
i.e.,
SM16LC05C-LF-T7.
5. No Suffix = Product Shipped in Tubes of 48 pcs per Tube.
0.045”
±
0.005”
Outline & Dimensions: Rev 1 - 11/01, 06007
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
05051.R10 4/05
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