Stacked Film Capacitor Chips
FEATURES
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STACKED METALLIZED POLYESTER FILM CONSTRUCTION
STANDARD EIA 1206, 1210, 1913 AND 2416 SIZES
EXCELLENT MOISTURE RESISTANCE
STABLE TEMPERATURE, FREQUENCY AND BIAS CHARACTERISTICS
REFLOW SOLDERING APPLICABLE
TAPE AND REEL PACKAGING
NSFC Series
SURFACE MOUNT
SPECIFICATIONS
Capacitance Range
Voltage Ratings*
Capacitance Tolerance
Temperature Range
Dissipation Factor (20 C)
Insulation Resistance (20 C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
o
o
Case Sizes
1206
1000pF ~ .056
µF
1210
5600pF ~ .1
µF
1913
.015
µ
F ~ .22
µF
2416
0.12
µ
F ~ 0.47
µF
16Vdc(12Vrms), 50Vdc(40Vrms), 100Vdc(75Vrms)
±5% (J)
-55°C ~ +105°C
1.0% max @ 1 KHz
3 Gigohms Minimum
175% of Rated Voltage (5 Seconds)
150% of Rated Voltage (60 Seconds)
±4%
∆
C Maximum Over Temperature Range
0.20 ~ 0.30% Typical
* -AC Voltage Ratings (Vrms) From 60 hz to 10Khz. Contact NIC For Derating At Higher Frequencies.
ENVIRONMENTAL CHARACTERISTICS
L i fe Te s t At + 1 0 5
o
C:
1000 Hour s at 125% of
Ra t e d Vo l t a g e
+ 2 6 0 C Pe a k fo r 5 Se c o n d s
H u m i d i t y L o a d L i fe * :
( 1 ) 1 0 0 0 H o u r s, + 4 0
o
C
(2) 500 Hours, +60 C
Solderability with
10% Wt Rosin-Methanol Flux
o
o
Capaci t ance Change
Di s s i p a t i o n Fa c t o r
I nsul at i on Resi st ance
Di s s i p a t i o n Fa c t o r
Capaci t ance Change ( 1) +8/ - 5%
Di s s i p a t i o n Fa c t o r
(1) 1.5% Max.
Wi t h i n + 1 / - 6 % o f I n i t i a l Va l u e
1 . 1 % M a x i mu m
1 G i g o h m M i n i mu m
Wi t h i n ± 5 % o f I n i t i a l Va l u e
1 . 1 % M a x i mu m
1 G i g o h m M i n i mu m
( 2 ) ± 1 0 % o f I n i t i a l Va l u e
(2) 2.0% Max.
Resi st ance t o Sol der i ng Heat : Capaci t ance Change
A f t e r 9 0 S e c o n d s a t + 1 5 5
o
C I n s u l a t i o n R e s i s t a n c e
I n s u l a t i o n Re s i s t a n c e (1) 100 Megohm Minimum (2) 10 Megohm Minimum
9 0 % M i n i m u m C o ve r a g e A f t e r 5 S e c o n d D i p
i n t o 2 3 5 ° C So l d e r Po t
* At 90 ~ 95% Relative Humidity and Rated Voltage
RECOMMENDED REFLOW PROFILE
RECOMMENDED LAND PATTERN
300
Temperature - Deg. C
250
200
150
100
50
25
Less Than
15 Seconds
Cool
Down
¦
¦
EIA Size
1206
1210
1913
2416
A
B
¦
B
3.8
3.8
6.6
7.8
C
1.4
2.3
3.0
3.8
¦
A
2.2
2.2
2.6
3.8
0
Pre-heat
150°C 120 seconds
2 Minutes Minimum
Time
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
173
¦
C
Peak Temperature
(230°C for 5 sec.)
¦
Stacked Film Capacitor Chips
STANDARD VALUES
SIZE CODE
Cap
µF
.001
.0012
.0015
.0018
.0022
.0027
.0033
.0039
.0047
.0056
.0068
.0082
.01
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.1
.12
.15
.18
.22
.27
.33
.39
.47
Code
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
Voltage (Vdc)
16
50
100
B2
B2
B2
B2
B2
B2
B3
B3
B3
C2
C2
C3
C3
D1
D1
D1
D1
D1
D1
D1
D2
NSFC Series
DIMENSION (mm)
Case Length
Code L + 0.2
B1
B2
B3
C1
C2
C3
D1
D2
D3
E1
E2
E3
E4
3.2
3.2
3.2
3.2
3.2
3.2
4.8
4.8
4.8
6.0
6.0
6.0
6.0
Width
W
1.6 + 0.2
1.6 + 0.2
1.6 + 0.2
2.5 + 0.2
2.5 + 0.2
2.5 + 0.2
3.3 + 0.2
3.3 + 0.2
3.3 + 0.2
4.1 + 0.3
4.1 + 0.3
4.1 + 0.3
4.1 + 0.3
Height
EIA
H + 0.2
0.8
1.0
1.4
1.0
1.4
2.0
1.4
2.0
2.8
1.8
2.0
2.4
2.8
1206
1206
1206
1210
1210
1210
1913
1913
1913
2416
2416
2416
2416
H
SURFACE MOUNT
B2
B2
B2
B2
B2
B3
B3
B3
C2
C2
C3
C3
D1
D2
D2
D3
E1
E2
E3
E4
B1
B1
B1
B1
B1
B2
B2
C1
C1
C2
C2
C2
C3
C3
C3
D2
D2
D3
D3
E1
E2
E3
E4
0.35 ±0.2
L
W
Plating of 95.5% Sn,
4% Ag and 0.5% Cu over
phosphorus copper
barrier over copper base
REEL DIMENSIONS (mm)/QUANTITY PER REEL
Case
D+2.0
D2
D3+2.0
W
t+0.5
Code
B1
B2
178 23.5 + 0.5 60.0 9.5 + 0.5 1.2
B3
C1,C2,C3
D1, E1
330 21.0 + 0.8 80.0 14.0 + 1.5 2.0
D2, E2
D3,E3,E4
Qty/
Reel
3,000
3,000
2,000
2,000
3,000
3,000
2,000
2.0
±
0.5
PART NUMBERING SYSTEM
NSFC 103 J 50 TR B2 F
Lead Free (Optional)
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%, G=±2%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
2.0
±0.5
13
±0 .0
.5
D1φ
TAPE DIMENSIONS (mm)
Case Code A ±0.1 B ±0.1 C ±0.2 t ±0.5 W ±0.3 F ±0.5 P ±0.1 Dφ + 0.2
A1
A2
B1
B2
B3
C1
C2
C3
D1
D2
D3 & D4
E1
E2
E3 & E4
E5
®
D2
φ
1.55
2.3
1.3
1.5
1.5
0.25
8.0
3.5
4.0
1.0
W
1.9
3.5
1.5
1.9
1.9
0.25
8.0
3.5
4.0
1.0
EMBOSSED PLASTIC CARRIER
0.25
8.0
3.5
4.0
1.0
2.8
3.5
1.9
2.5
2.0
¦ ¦
t
1.5 +0.1
-0
¦
¦
4.0 +0.1
¦
¦
3.8
5.1
2.6
3.4
2.7
0.30
12.0
5.5
8.0
1.5
¦
B
¦
¦
D∅
P
F
4.6
6.3
2.7
3.5
4.6
0.30
12.0
5.5
8.0
1.5
¦
C
¦
¦
A
¦
¦
¦
174
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
¦
W
¦
1.75
±0.1
¦
¦
D3φ
¦
¦
¦
¦
¦
¦
¦
¦
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