WE128K32-XXX
128Kx32 EEPROM MODULE, SMD 5962-94585
FEATURES
Access Times of 125, 140, 150, 200, 250, 300ns
Packaging:
• 66-pin, PGA Type, 27.3mm (1.075") square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180") high,
(Package 509)
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
Write Endurance 10,000 Cycles
Data Retention Ten Years Minimum (at +25°C)
Commercial, Industrial and Military Temperature Ranges
Low Power CMOS
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
*This product is subject to change without notice.
Data Polling for End of Write Detection
Hardware and Software Data Protection
TTL Compatible Inputs and Outputs
5 Volt Power Supply
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
Weight
WE128K32-XG2TX – 8 grams typical
WE128K32-XH1X – 13 grams typical
FIGURE 1 – PIN CONFIGURATION FOR WE128K32N-XH1X
TOP VIEW
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
OE#
A
0-16
128K x 8
W E
1
# CS
1
#
PIN DESCRIPTION
56
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
V
CC
GND
NC
Data Input/Output
Address Inputs
Write Enable
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E
2
# CS
2
#
W E
3
# CS
3
#
W E
4
# CS
4
#
128K x 8
128K x 8
128K x 8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
WE128K32-XXX
FIGURE 3 – PIN CONFIGURATION FOR WE128K32-XG2TX
TOP VIEW
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
V
CC
GND
NC
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
#
GND
CS
4
#
WE
1
#
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
Data Input/Output
Address Inputs
Write Enable
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
OE#
CS
1
#
CS
2
#
NC
WE
2
#
WE
3
#
WE
4
#
V
CC
BLOCK DIAGRAM
W E
1
# CS
1
#
OE#
A
0-16
128K x 8
128K x 8
128K x 8
128K x 8
W E
2
# CS
2
#
W E
3
# CS
3
#
W E
4
# CS
4
#
A
12
A
13
A
14
A
15
A
16
A
11
NC
NC
NC
8
8
8
8
The WEDC 68 lead CQFP
fi
lls the same
fi
t and function
as the JEDEC 68 lead CQFJ or 68 PLCC. But it has the
TCE and lead inspection advantage of the CQFP form.
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
2
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
WE128K32-XXX
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Voltage on OE# and A9
Symbol
T
A
T
STG
V
G
-55 to +125
-65 to +150
-0.6 to + 6.25
-0.6 to +13.5
Unit
°C
°C
V
V
CS#
H
L
L
X
X
X
OE#
X
L
H
H
X
L
TRUTH TABLE
WE#
X
H
L
X
H
X
Mode
Standby
Read
Write
Out Disable
Write
Inhibit
Data I/O
High Z
Data Out
Data In
High Z/Data Out
NOTE:
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAPACITANCE
T
A
= +25°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
Symbol
V
CC
V
IH
V
IL
T
A
T
A
Min
4.5
2.0
-0.5
-55
-40
Max
5.5
V
CC
+ 0.3
+0.8
+125
+85
Unit
V
V
V
°C
°C
Parameter
OE# capacitance
WE1-4# capacitance
HIP (PGA)
CQFP G2T
CS1-4# capacitance
Data I/O capacitance
Address input capacitance
Symbol
C
OE
C
WE
Conditions
V
IN
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
C
CS
C
I/O
C
AD
V
IN
= 0 V, f = 1.0 MHz
V
I/O
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
Max Unit
50
pF
pF
20
20
20
pF
20
pF
50
pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS
V
CC
= 5.0V, GND = 0V, -55°C
≤
T
A
≤
+125°C
Parameter
Input Leakage Current
Output Leakage Current
Operating Supply Current (x32)
Standby Current
Output Low Voltage
Output High Voltage
Symbol
I
LI
I
LOx32
I
CCx32
I
SB
V
OL
V
OH
Conditions
V
CC
= 5.5, V
IN
= GND to V
CC
CS# = V
IH
, OE# = V
IH
, V
OUT
= GND to V
CC
CS# = V
IL
, OE# = V
IH
, f = 5MHz
CS# = V
IH
, OE# = V
IH
, f = 5MHz
I
OL
= 2.1mA, V
CC
= 4.5V
I
OH
= -400μA, V
CC
= 4.5V
Min
Max
10
10
250
2.5
0.45
Unit
μA
μA
mA
mA
V
V
2.4
NOTE: DC test conditions: V
IH
= V
CC
-0.3V, V
IL
= 0.3V
FIGURE 3 AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
Typ
V
IL
= 0, V
IH
= 3.0
5
1.5
1.5
Unit
V
ns
V
V
IOL
Current Source
D.U.T
Ceff = 50 pf
Vz ~ 1.5V
~
Bipolar Supply
Notes: V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75Ω.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
Current Source
IOH
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
3
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
WE128K32-XXX
WRITE
A write cycle is initiated when OE# is high and a low pulse is on
WE# or CS# with CS# or WE# low. The address is latched on the
falling edge of CS# or WE# whichever occurs last. The data is
latched by the rising edge of CS# or WE#, whichever occurs
fi
rst.
A byte write operation will automatically continue to completion.
AC WRITE CHARACTERISTICS
V
CC
= 5.0V, GND = 0V, -55°C
≤
T
A
≤
+125°C
Write Cycle Parameter
Write Cycle Time, TYP = 6ms
Address Set-up Time
Write Pulse Width (WE# or CS#)
Chip Select Set-up Time
Address Hold Time
Data Hold Time
Chip Select Hold Time
Data Set-up Time
Output Enable Set-up Time
Output Enable Hold Time
Write Pulse Width High
Symbol
t
WC
t
AS
t
WP
t
CS
t
AH
t
DH
t
CSH
t
DS
t
OES
t
OEH
t
WPH
0
100
0
100
10
0
50
0
0
50
Min
Max
10
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
WRITE CYCLE TIMING
Figures 5 and 6 show the write cycle timing relationships. A write
cycle begins with address application, write enable and chip select.
Chip select is accomplished by placing the CS# line low. Write
enable consists of setting the WE# line low. The write cycle begins
when the last of either CS# or WE# goes low.
The WE# line transition from high to low also initiates an internal
150
μsec
delay timer to permit page mode operation. Each
subsequent WE# transition from high to low that occurs before the
completion of the 150
μsec
time out will restart the timer from zero.
The operation of the timer is the same as a retriggerable one-shot.
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
4
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
WE128K32-XXX
FIGURE 5 – WRITE WAVEFORMS WE# CONTROLLED
t
WC
OE#
t
OES
ADDRESS
CS
1-4
#
WE
1-4
#
t
WP
t
DS
DATA IN
t
WPH
t
DH
t
AS
t
CS
t
AH
t
CSH
t
OEH
FIGURE 6 – WRITE WAVEFORMS CS# CONTROLLED
t
WC
OE#
t
OES
ADDRESS
WE
1 - 4#
CS
1 - 4#
t
WP
t
DS
DATA IN
t
WPH
t
DH
t
AS
t
CS
t
AH
t
CSH
t
OEH
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 15
© 2012 Microsemi Corporation. All rights reserved.
5
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
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