EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 101106078 |
包装说明 | DIP, DIP28,.6 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 70 ns |
命令用户界面 | NO |
数据轮询 | YES |
JESD-30 代码 | R-XDIP-T28 |
JESD-609代码 | e0 |
内存密度 | 262144 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
端子数量 | 28 |
字数 | 32768 words |
字数代码 | 32000 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX8 |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.03 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
切换位 | NO |
28C256-07I/J | 28C256-15/J | 28C256-15I/J | 28C256-15/P | 28C256-15 | 28C256-07I | 28C256-07M | 28C256-07M/J | 28C256-10 | 28C256-10/J | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 150ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 150ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 150ns, Parallel, CMOS, PDIP28 | EEPROM, 32KX8, 150ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 100ns, Parallel, CMOS, CDIP28 | EEPROM, 32KX8, 100ns, Parallel, CMOS, CDIP28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 70 ns | 150 ns | 150 ns | 150 ns | 150 ns | 70 ns | 70 ns | 70 ns | 100 ns | 100 ns |
命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 262144 bit | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
切换位 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Objectid | 101106078 | - | - | - | - | 101106077 | 101106083 | 101106084 | 101106073 | 101106074 |
ECCN代码 | EAR99 | - | - | - | - | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved