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VSM88

产品描述Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration
文件大小121KB,共3页
制造商Vishay(威世)
官网地址http://www.vishay.com
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VSM88概述

Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration

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VSM85, 86, 87, 88, 89
Vishay Foil Resistors
SURFACE MOUNT
Bulk Metal
®
Foil Technology
Surface Mount Hermetic Resistor Networks In
Leadless Chip Carrier (LCC) Configuration
Vishay Model VSM networks incorporate all the performance
features of Vishay Bulk Metal
®
Foil technology in a product
ready for surface mounting. The multi-terminal ceramic LCC
has gold plated terminals which wrap around from the side of the
package to the underside for either socket or surface mounting.
See data sheet “7 Technical Reasons to Specify Bulk Metal
®
Foil Resistor Networks.”
Product may not
be to scale
ORDERING INFORMATION - VSM85, VSM86,
VSM87, VSM88 OR VSM89 NETWORKS
Networks are built to your requirements. Send your schematic
and electrical requirements to the Applications Engineering
Department. (See data sheet “Network Worksheet:.) A unique
part number will be assigned which defines all aspects of your
network.
FIGURE 1 - PACKAGE SIZES AND CHARACTERISTICS
L
0.100
(2.45)
REFERENCE
NOTE:
1. These networks utilize Vishay Bulk Metal
®
Foil
resistor chips V5X5 and V15X5 or VTF15X5 Thin
Film chips.
2. The V5X5 and V15X5 chips have maximum
resistance values of 10K and 33K respectively in
Bulk Metal
®
Foil and 500K in VTF15X5 Thin Film
chips.
3. The V5X5 and V15X5 chip(s) can be intermixed
in a package.
CHIP CAPACITY
LL
N/A
N/A
N/A
N/A
N/A
V5X5
12
16
16
25
35
MAXIMUM POWER RATING
(WATTS) @ +70
°
C
V15X5
4
4
5
10
14
0.4
0.6
0.6
1.0
1.4
W
0.050
(1.27)
TYPICAL
0.025
TYPICAL
(0.64)
0.008
REFERENCE
(0.20)
TYPICAL
0.025
(0.64)
0.050
0.012
R REF TYPICAL
(1.27)
(0.30)
0.045
(1.14)
TYPICAL
H
VISHAY
MODEL
VSM85
VSM86
VSM87
VSM88
VSM89
NO. OF
PINS
16
20
24
28
32
MAXIMUM DIMENSIONS in Inches (mm)
L
0.295 (7.493)
0.360 (9.144)
0.345 (8.763)
0.460 (11.684)
0.460 (11.684)
W
0.360 (9.144)
0.360 (9.144)
0.345 (8.763)
0.460 (11.684)
0.560 (14.224)
H
0.090 (2.286)
0.090 (2.286)
0.090 (2.286)
0.090 (2.286)
0.090 (2.286)
FIGURE 2 - SAMPLE CIRCUIT DESIGN AND CHIP LAYOUT
10
11
R6
12
R9
R1
13
14
15
16
1
2
R4
R8
R3
R10
R2
4
4
R5
3
R2
R5
R7
5
9
8
7
6
NOTE:
Usable area is represented by the dotted lines— a rectangle 0.150"
x 0.200". Illustrations not to scale. Chips shown undersize for
clarity. Drawing view is from the top looking down into the package.
13
R1
R3
1
8
R7
R4
16
9
R6
R8
5
R10
R9
12
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
www.vishay.com
52
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63028
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 08-Mar-05

VSM88相似产品对比

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描述 Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration Bulk Metal® Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier (LCC) Configuration
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