VSM1506
Vishay Foil Resistors
SURFACE MOUNT
Bulk Metal
®
Foil Technology
Discrete High Precision Surface Mount Chip Resistor
FEATURES
• High Precision, Low TCR
• Temperature Coefficient of Resistance:
Nominal TCR: + 0.6ppm/°C (0°C to + 25°C)
- 0.6ppm/°C (+ 25°C to + 60°C)
+ 2.2ppm/°C (- 55°C to + 25°C)
- 1.8ppm/°C (+ 25°C to + 125°C)
• Resistance Range: 10Ω to 40KΩ
• Tolerance: to
±
0.01% (See table 1)
• Load Life Stability:
±
0.01% maximum
∆R
under full rated
power @ + 70°C for 2000 hours.
• Shelf Life Stability: 50ppm/year (0.005%) maximum
∆R
non-hermetically sealed
• Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)
• Current Noise: < 0.010µV(rms)/volt of applied voltage
• Non Inductive: < 3.0nH
• Terminal Finishes Available:
Lead (Pb)-free (Sn 99.3% Cu 0.7%)
Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%)
Product may not
be to scale
The VSM1506 Discrete Precision Chip Resistor uses the Bulk
Metal
®
Foil (BMF) Technology for the resistance element. The
BMF provides inherently a low and predictable temperature
coefficient of resistance (TCR) and remarkable load life stability
for precision analog applications. The predictable TCR
variation is independent of value, date code, time and is
expressed via the curve shown below.
The VSM1506 has a newly designed, robust termination which
insures safe handling during the manufacturing process as
well as providing stability during the multiple thermal cyclings
it will see over its service life.
The load life specification has been improved providing even
greater life stability and the ohmic value has been extended
from 33K to 40K Ohms.
A voltage divider can be fashioned by using two arbitrarily
selected VSM1506s; with a resultant tracking specification of
< 3ppm/°C.
The VSM1506 replaces the VSM1505 for new designs.
TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE
VALUE
(
Ω
)
100Ω to 40KΩ
50Ω to < 100Ω
25Ω to < 50Ω
STANDARD TOLERANCE*
(%)
±
0.01
±
0.05
±
0.1
10Ω to < 25Ω
±
0.25
*Tighter tolerances are available. Please contact Application
Engineering. Soldering temperatures used during installation may
cause resistance to shift up to 0.01%.
FIGURE 1 - NOMINAL TCR CURVE
–55
–50
+500
+400
+300
+200
+100
–25
0
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
TEST
MIL-PRF-55342G
CHARACTERISTIC E
∆
R LIMITS
±
0.10%
±
0.10%
±
0.10%
±
0.10%
±
0.20%
±
0.20%
±
0.50%
100
63
12
VSM1506
MAXIMUM
∆
R LIMITS*
±
0.02%
±
0.02%
±
0.02%
±
0.03%
±
0.01%
±
0.03%
±
0.01%
+25
+50
+75
+100
+125
-5
p
+5
pp
m
pm
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Moisture Resistance
Life 2000 hours @ + 70
°
C
Power @ + 70
°
C (mW)
Nominal Resistance/
Temperature (RT) Curve
∆R
R
(ppm)
0
–100
–200
–300
–400
–500
Maximum
Spread
±2.3
ppm/°C
+2.2 ppm/°C
Nominal Chord
Slope (TCR)
–1.8 ppm/°C
Nominal Chord
Slope (TCR)
Standard
Spread
±2.0
ppm/°C
–55°C / +25°C / +125°C are the test points
with +25°C as the reference temperature
The TCR for values < 100Ω are influenced by the termination
composition and result in a deviation from this curve. Contact our
application engineering department for detailed specification on low
values
Maximum Voltage (V)
Maximum Weight (mg)
*As shown + 0.01 Ohms to allow for measurement errors at low values.
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
www.vishay.com
24
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63071
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 17-Aug-04
VSM1506
Bulk Metal
®
Foil Technology
Vishay Foil Resistors
Discrete High Precision Surface Mount Chip Resistor
SURFACE MOUNT
FIGURE 2 - DERATING CURVE
FIGURE 3 - RECOMMENDED MOUNTING
Percent of Rated Power
125
100
–55°C
+70°C
Rated Power
25% to 85% of T
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
TABLE 3 - CHIP SIZES AND SPECIFICATIONS
in inches (millimeters)
Bottom View for Mounting
Uncoated
Ceramic
L
X
T
D
W
G
Z
Footprint
Recommended Land Pattern
L
±
0.005 [0.13]
0.150
[3.81]
W
±
0.005 [0.13]
0.062
[1.57]
T
MAXIMUM
0.025
[0.64]
D
±
0.005 [0.13]
0.020
[0.50]
Z*
MAXIMUM
0.199
[5.046]
G*
MINIMUM
0.083
[2.108]
X*
MAXIMUM
0.071
[1.806]
*Land Pattern Dimensions are per IPC-782
TABLE 4 - ORDERING INFORMATION
MODEL
VSM
CHIP SIZE
1506
RESISTANCE
RANGE
5Ω to < 1KΩ
RESISTANCE VALUE
LETTER
DESIGNATOR
R
MULTIPLIER
FACTOR
x 1.0
TOLERANCE
T
±
0.01%
Q
±
0.02%
A
±
0.05%
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
TERMINATION
S
- Lead (Pb)-free
B
- Tin/Lead
PACKAGING
T = Tape and
Reel
W = Waffle
Pack
Example: 249R00 = 249Ω
1K to 40K
K
x 10
3
Example: 10K000 = 10.0KΩ
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
For technical questions in the Americas, contact foilsupport1@vishay.com
Document Number: 63071
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Revision 17-Aug-04
www.vishay.com
25
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