VSM1206
Vishay Foil Resistors
SURFACE MOUNT
Bulk Metal
®
Foil Technology
Discrete High Precision Surface Mount Chip Resistor
FEATURES
• High Precision: Tolerance to
±
0.01% (see table 1)
• Low Temperature Coefficient of Resistance:
Nominal TCR: + 0.5ppm/°C (- 55°C to + 125°C)
• Resistance Range: 10Ω to 30KΩ
Product may not
be to scale
• Load Life Stability:
±
0.01% maximum
∆R
under full
rated power at + 70°C for 2000 hours.
• Shelf Life Stability: 50ppm/year (0.005%) maximum
∆R
non-hermetically sealed
• Power Rating at + 70°C: 125mW
• Maximum Working Voltage: 61V
• Maximum Weight: 11mg
• Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)
• Current Noise: < 0.01µV(rms)/volt of applied voltage
• Non Inductive: < 0.08nH
The VSM1206 Precision Surface Mount Chip Resistor utilizes
Ultra Precision Bulk Metal
®
Z Foil (BMZF) for the resistive
element.
The BMZF technology provides inherently an extremely low
and predictable Temperature Coefficient of Resistance
(TCR), remarkable load life stability, low noise and availability
of tight tolerance.
The TCR is a process capability not a selection process and
for most of the range is independent of ohmic value and lot
related variations. The TCR curve on Fig. 1 demonstrates
the new revolutionary Z Foil with its TCR nominal of
0.5ppm/°C.
A voltage divider can be fashioned by using two arbitrarily
selected VSM1206s with a resultant tracking specification
of < 3ppm/°C. Extremely low tracking of < 1ppm/°C can be
supplied upon request.
The VSM1206 has a conventional full wrap around robust
termination which insures safe handling during manufacturing
process, as well as providing stability during the multiple
thermal cyclings it will see over its service life.
The availability of tight absolute tolerance provides a good
cost solution for the variability of other components when
compiling the total error budget. BMZF offers the best
stability available; and is more than an order of magnitude
better than thin film technology. The noise generated by
the resistor is non measurable and its design and
construction make it well suited for high frequency
applications. The BMZF is the ultimate resistor component
for analog applications.
VISHAY FOIL • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
• GERMANY +49.9287.710 FAX: +49 9287.70435
• ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
TABLE 1 TOLERANCE AND TCR VS
RESISTANCE VALUE
VALUE
(
Ω
)
100Ω to 30KΩ
50Ω to < 100Ω
25Ω to < 50Ω
STANDARD
TOLERANCE* (%)
±
0.01
±
0.05
±
0.1
MAXIMUM
TCR**
±
2ppm/°C
±
3ppm/°C
±
3ppm/°C
10Ω to < 25Ω
±
0.25
±
4ppm/°C
*Tighter tolerances are available. Please contact Vishay Application Engineering.
**Over MIL range (- 55°C to + 125°C, + 25°C reference)
FIGURE 1 - NOMINAL TCR CURVE
∆R
R
(PPM)
+ 150
+ 100
+ 50
0
- 50
- 100
- 150
- 200
- 50
- 55
- 25
0
+ 25
+ 50
+ 75
+ 100
+ 125
Z Foil 0.5PPM/
°
C
Ambient Temperature (
°
C)
The TCR for values < 100Ω are influenced by the termination
composition and result in a deviation from this curve.
• ITALY + 39.2.300.11919 FAX: +39.2.300.11999
• JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433
• SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
• UK +44 191 514 8237 FAX: +44 1953 457 722
• USA +1 610 407-4800 FAX: +1 610 640-9081
www.vishay.com
24
Document Number: 63090
Revision 21-May-03
VSM1206
Bulk Metal
®
Foil Technology
Vishay Foil Resistors
Discrete High Precision Surface Mount Chip Resistor
SURFACE MOUNT
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
TEST
MIL-PRF-55342G
VSM1206
CHARACTERISTIC E MAXIMUM
∆
R LIMITS
∆
R LIMITS*
±
0.10%
±
0.10%
±
0.10%
±
0.10%
±
0.20%
±
0.20%
±
0.50%
±
0.02%
±
0.02%
±
0.02%
±
0.03%
±
0.01%
±
0.03%
±
0.01%
FIGURE 2 - DERATING CURVE
Percent of Rated Power
125
100
75
50
25
0
-75
–55°C
+70°C
Rated Power
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Moisture Resistance
Life 2000 hours @ + 70
°
C
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
FIGURE 3 - RECOMMENDED MOUNTING
*As shown + 0.01 Ohms to allow for measurement errors at low values.
25% to 85% of T
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
TABLE 3 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
Bottom View for Mounting
Uncoated
Ceramic
L
X
T
D
W
G
Z
Footprint
Recommended Land Pattern
L
W
±
0.005 [0.13]
0.126
[3.2]
±
0.005 [0.13]
0.062
[1.57]
T
MAXIMUM
0.025
[0.64]
D
±
0.005 [0.13]
0.020
[0.50]
Z*
MAXIMUM
0.175
[4.4]
G*
MINIMUM
0.059
[1.5]
X*
MAXIMUM
0.071
[1.806]
*Land Pattern Dimensions are per IPC-782
TABLE 4 - ORDERING INFORMATION
MODEL
VSM
CHIP SIZE
1206
RESISTANCE
RANGE
RESISTANCE VALUE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
x 1.0
TOLERANCE
T
±
0.01%
Q
±
0.02%
A
±
0.05%
10Ω to < 1KΩ
R
Example: 249R00 = 249Ω
1K to 30K
K
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
TERMINATION
B = Solderable
PACKAGING
T = Tape and
Reel
W = Waffle
Pack
x 10
3
Example: 10K000 = 10.0KΩ
VISHAY FOIL • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
• GERMANY +49.9287.710 FAX: +49 9287.70435
• ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
• ITALY + 39.2.300.11919 FAX: +39.2.300.11999
• JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433
• SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
• UK +44 191 514 8237 FAX: +44 1953 457 722
• USA +1 610 407-4800 FAX: +1 610 640-9081
Document Number: 63090
Revision 21-May-03
www.vishay.com
25
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