
Digital Power Compatible Synchronous Buck Driver 20-VQFN -40 to 105
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC20,.20SQ,25 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 12 weeks |
| Samacsys Descripti | Synchronous Buck Gate Drive |
| 高边驱动器 | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | S-PQCC-N20 |
| JESD-609代码 | e4 |
| 湿度敏感等级 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 4 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC20,.20SQ,25 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 12 V |
| 认证状态 | Not Qualified |
| 最大供电电压 | 15 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 12 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| UCD7230ARGWT | UCD7230ARGWR | |
|---|---|---|
| 描述 | Digital Power Compatible Synchronous Buck Driver 20-VQFN -40 to 105 | Digital Power Compatible Synchronous Buck Driver 20-VQFN -40 to 105 |
| Brand Name | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | QFN |
| 包装说明 | HVQCCN, LCC20,.20SQ,25 | HVQCCN, LCC20,.20SQ,25 |
| 针数 | 20 | 20 |
| Reach Compliance Code | compli | compliant |
| ECCN代码 | EAR99 | EAR99 |
| Factory Lead Time | 12 weeks | 12 weeks |
| 高边驱动器 | YES | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | S-PQCC-N20 | S-PQCC-N20 |
| JESD-609代码 | e4 | e4 |
| 湿度敏感等级 | 2 | 2 |
| 端子数量 | 20 | 20 |
| 最高工作温度 | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 最大输出电流 | 4 A | 4 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN |
| 封装等效代码 | LCC20,.20SQ,25 | LCC20,.20SQ,25 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 |
| 电源 | 12 V | 12 V |
| 认证状态 | Not Qualified | Not Qualified |
| 最大供电电压 | 15 V | 15 V |
| 最小供电电压 | 4.5 V | 4.5 V |
| 标称供电电压 | 12 V | 12 V |
| 表面贴装 | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD |
| 端子节距 | 0.635 mm | 0.635 mm |
| 端子位置 | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
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