SMDA05 THRU SMDA24
Unidirectional TVS Array
for Protection of Four Lines
PROTECTION PRODUCTS
Description
The SMDAxx series of TVS arrays are designed to provide
undirectional protection for sensitive electronics from
damage or latch-up due to ESD, lightning and other
voltage-induced transient events. Each device will
protect four data or I/O lines. They are available with
operating voltages of 5V, 12V, 15V and 24V.
TVS diodes are solid-state devices designed specifically
for transient suppression. They offer desirable charac-
teristics for board level protection including fast re-
sponse time, low operating and clamping voltage and no
device degradation. The low profile SO-8 package allows
the user to protect up to four independent lines with one
package. The SMDAxx series is suitable protection for
sensitive semiconductors components such as micropro-
cessors, ASICs, transceivers, transducers, and CMOS
memory.
The SMDAxx series devices may be used to meet the
ESD immunity requirements of IEC 61000-4-2, level 4 for
air and contact discharge.
Features
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Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Undirectional protection
Small SO-8 package
Protects four I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
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Mechanical Characteristics
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Applications
RS-232 data lines
Microprocessor based equipment
Notebooks, Desktops, & Servers
Instrumentation
LAN/WAN equipment
Peripherals
Serial and Parallel Ports
Schematic & PIN Configuration
1
8
2
7
3
6
4
5
SO-8 (Top View)
Revision 9/2000
1
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SMDA05 THRU SMDA24
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Pow er (tp = 8/20µ s)
ESD Voltage (HBM p er (IEC 61000-4-2)
Lead Sold ering Temp erature
Op erating Temp erature
Storage Temp erature
T
L
T
J
T
STG
Symbo l
P
p k
Value
300
>25
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
kV
°C
°C
°C
Electrical Characteristics
SMDA05
Par ame te r
Reverse Stand -Off Voltage
Reverse Breakd ow n Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbo l
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
j
I
t
= 1mA
V
RWM
= 5V, T=25°C
I
PP
= 1A , tp = 8/20µ s
I
PP
= 5A , tp = 8/20µ s
tp = 8/20µ s
V
R
= 0V, f = 1MHz
6
20
9.8
11
17
400
Co nd itio ns
Minimum
Typ ical
Maximum
5
Units
V
V
µA
V
V
A
pF
SMDA12
Par ame te r
Reverse Stand -Off Voltage
Reverse Breakd ow n Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbo l
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
j
I
t
= 1mA
V
RWM
= 12V, T=25°C
I
PP
= 1A , tp = 8/20µ s
I
PP
= 5A , tp = 8/20µ s
tp = 8/20µ s
V
R
= 0V, f = 1MHz
13.3
1
19
24
12
150
Co nd itio ns
Minimum
Typ ical
Maximum
12
Units
V
V
µA
V
V
A
pF
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SMDA05 THRU SMDA24
PROTECTION PRODUCTS
Electrical Characteristics
(Continued)
SMDA15
Par ame te r
Reverse Stand -Off Voltage
Reverse Breakd ow n Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbo l
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
j
I
t
= 1mA
V
RWM
= 15V, T=25°C
I
PP
= 1A , tp = 8/20µ s
I
PP
= 5A , tp = 8/20µ s
tp = 8/20µ s
V
R
= 0V, f = 1MHz
16.7
1
24
30
10
100
Co nd itio ns
Minimum
Typ ical
Maximum
15
Units
V
V
µA
V
V
A
pF
SMDA24
Par ame te r
Reverse Stand -Off Voltage
Reverse Breakd ow n Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbo l
V
RWM
V
BR
I
R
V
C
V
C
I
PP
C
j
I
t
= 1mA
V
RWM
= 24V, T=25°C
I
PP
= 1A , tp = 8/20µ s
I
PP
= 5A , tp = 8/20µ s
tp = 8/20µ s
V
R
= 0V, f = 1MHz
26.7
1
43
55
5
60
Co nd itio ns
Minimum
Typ ical
Maximum
24
Units
V
V
µA
V
V
A
pF
ã
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SMDA05 THRU SMDA24
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
110
100
Peak Pulse Power - P
PP
(kW)
90
% of Rated Power or I
PP
80
70
60
50
40
30
20
10
0.01
0.1
1
10
Pulse Duration - tp (µs)
100
1000
0
0
25
50
75
100
o
Power Derating Curve
1
0.1
125
150
Ambient Temperature - T
A
( C)
Pulse Waveform
110
100
90
80
Percent of I
PP
70
60
50
40
30
20
10
0
0
5
10
15
Time (µs)
20
25
30
td = I
PP
/2
e
-t
Waveform
Parameters:
tr = 8µs
td = 20µs
ESD Pulse Waveform (IEC 61000-4-2)
Level
IEC 61000-4-2 Discharge Parameters
First
Peak
Current
(A)
1
2
3
4
7.5
15
22.5
30
Peak
Current
at 30 ns
(A)
4
8
12
16
Peak
Current
at 60 ns
(A)
8
4
6
8
Test
Test
Voltage
Voltage
(Contact
( A ir
Disch arge) Disch arge)
(kV )
(kV )
2
4
6
8
2
4
8
15
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SMDA05 THRU SMDA24
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Four Data Lines
The SMDAxx series devices are designed to protect up to
four data lines. The devices are connected as follows:
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Circuit Diagram
The SMDAxx are unidirectional devices and are
designed for use on lines where the normal operat-
ing voltage is above ground. Pins 1, 2, 3, and 4 are
connected to the protected lines. Pins 5, 6, 7, and 8
are connected to ground. The ground connections
should be made directly to the ground plane for best
results. The path length is kept as short as possible
to reduce the effects of parasitic inductance in the
board traces.
1
8
2
7
3
6
4
5
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
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l
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I/O Line Protection
Place the TVS near the input terminals or connectors
to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Typical Connection
To Protected
Device
1
8
2
7
Ground
3
6
4
5
From Connector
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