TSTS7100
Vishay Semiconductors
Infrared Emitting Diode, RoHS Compliant, 950 nm, GaAs
FEATURES
• Package type: leaded
• Package form: TO-18
• Dimensions (in mm):
∅
4.7
• Peak wavelength:
λ
p
= 950 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity:
ϕ
= ± 5°
94
8483
• Low forward voltage
• Suitable for high pulse current operation
• Good spectral matching with Si photodetectors
• Lead (Pb)-free component in accordance
RoHS 2002/95/EC and WEEE 2002/96/EC
with
DESCRIPTION
TSTS7100 is an infrared, 950 nm emitting diode in GaAs
technology in a hermetically sealed TO-18 package with
lens.
APPLICATIONS
• Radiation source in near infrared range
PRODUCT SUMMARY
COMPONENT
TSTS7100
I
e
(mW/sr)
> 10
ϕ
(deg)
±5
λ
P
(nm)
950
t
r
(ns)
800
Note
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
TSTS7100
Note
MOQ: minimum order quantity
PACKAGING
Bulk
REMARKS
MOQ: 1000 pcs, 1000 pcs/bulk
PACKAGE FORM
TO-18
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Reverse voltage
Forward current
Peak forward current
Surge forward current
Power dissipation
Junction temperature
Storage temperature range
Thermal resistance junction/ambient
Thermal resistance junction/case
Note
T
amb
= 25 °C, unless otherwise specified
leads not soldered
leads not soldered
T
case
≤
25 °C
t
p
/T = 0.5, t
p
≤
100 µs, T
case
≤
25 °C
t
p
≤
100 µs
T
case
≤
25 °C
TEST CONDITION
SYMBOL
V
R
I
F
I
FM
I
FSM
P
V
P
V
T
j
T
stg
R
thJA
R
thJC
VALUE
5
250
500
2.5
170
500
100
- 55 to + 100
450
150
UNIT
V
mA
mA
A
mW
mW
°C
°C
K/W
K/W
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For technical questions, contact: emittertechsupport@vishay.com
Document Number: 81047
Rev. 1.8, 04-Sep-08
TSTS7100
Infrared Emitting Diode, RoHS Compliant,
Vishay Semiconductors
950 nm, GaAs
600
P
V
- Power Dissipation (mW)
500
400
300
200
R
thJA
100
0
0
12790
300
I
F
- Forward Current (mA)
R
thJC
250
200
R
thJC
150
100
50
0
25
50
75
100
125
94
8018
R
thJA
0
20
40
60
80
100
T
amb
- Ambient Temperature (°C)
T
amb
- Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER
Forward voltage
Temperature coefficient of V
F
Breakdown voltage
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of
φ
e
Angle of half intensity
Peak wavelength
Spectral bandwidth
Rise time
Virtual source diameter
Note
T
amb
= 25 °C, unless otherwise specified
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
I
F
= 1.5 A, t
p
/T = 0.01, t
p
≤
10 µs
TEST CONDITION
I
F
= 100 mA, t
p
≤
20 ms
I
F
= 100 mA
I
R
= 100 µA
V
R
= 0 V, f = 1 MHz, E = 0
I
F
= 100 mA, t
p
=
20 ms
I
F
= 100 mA, t
p
≤
20 ms
I
F
= 100 mA
SYMBOL
V
F
TK
VF
V
(BR)
C
j
I
e
φ
e
TKφ
e
ϕ
λ
p
Δλ
t
r
t
r
d
10
7
- 0.8
±5
950
50
800
400
1.5
5
30
50
MIN.
TYP.
1.3
- 1.3
MAX.
1.7
UNIT
V
mV/K
V
pF
mW/sr
mW
%/K
deg
nm
nm
ns
ns
mm
BASIC CHARACTERISTICS
T
amb
= 25 °C, unless otherwise specified
10
1
10
4
10
3
10
2
10
1
10
0
10
-1
10
-1
10
0
10
1
10
2
94 7996
I
F
- Forward Current (A)
I
FSM
= 2.5 A (single pause)
t
p
/T= 0.01
10
0
0.05
0.1
0.2
0.5
10
-1
10
-2
I
F
- Forward Current (mA)
0
1
2
3
4
94
8003
t
p
- Pulse Duration (ms)
V
F
- Forward
Voltage
(V)
Fig. 3 - Pulse Forward Current vs. Pulse Duration
Document Number: 81047
Rev. 1.8, 04-Sep-08
Fig. 4 - Forward Current vs. Forward Voltage
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261
For technical questions, contact: emittertechsupport@vishay.com
TSTS7100
Vishay Semiconductors
Infrared Emitting Diode, RoHS Compliant,
950 nm, GaAs
1.2
V
F rel
- Relative Forward
Voltage
(V)
1.1
I
F
= 10 mA
1.0
0.9
1.6
1.2
I
e rel
;
Φ
e rel
I
F
= 20 mA
0.8
0.8
0.7
0
20
40
60
80
100
0.4
0
- 10 0 10
94 7993
50
100
140
94 7990
T
amb
- Ambient Temperature (°C)
T
amb
- Ambient Temperature (°C)
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
Fig. 8 - Rel. Radiant Intensity/Power vs. Ambient Temperature
1000
I
e
- Radiant Intensity (mW/sr)
1.25
Φ
e rel
- Relative Radiant Power
100
1.0
0.75
0.5
10
1
t
p
/T = 0.01 , t
p
= 20
µs
0.1
10
0
10
1
10
2
10
3
10
4
0.25
I
F
= 100 mA
0
900
950
1000
94
8001
I
F
- Forward Current (mA)
94 7994
λ
-
Wavelength
(nm)
Fig. 6 - Radiant Intensity vs. Forward Current
Fig. 9 - Relative Radiant Power vs. Wavelength
0°
10°
20°
30°
100
I
e rel
- Relative Radiant Intensity
1000
Φ
e
- Radiant Power (mW)
40°
1.0
0.9
0.8
0.7
50°
60°
70°
80°
10
1
0.1
10
0
94 7977
10
1
10
2
10
3
I
F
- Forward Current (mA)
10
4
94
8019
0.6
0.4
0.2
0
0.2
0.4
0.6
Fig. 7 - Radiant Power vs. Forward Current
Fig. 10 - Relative Radiant Intensity vs. Angular Displacement
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262
For technical questions, contact: emittertechsupport@vishay.com
Document Number: 81047
Rev. 1.8, 04-Sep-08
TSTS7100
Infrared Emitting Diode, RoHS Compliant,
Vishay Semiconductors
950 nm, GaAs
PACKAGE DIMENSIONS
in millimeters
A
C
4.7
+ 0.05
- 0.10
± 0.25
Chip position
(2.5)
6.5
0.45
+ 0.02
- 0.05
13.2
± 0.7
5.5
2.54 nom.
± 0.15
technical drawings
according to DIN
specifications
Lens
Drawing-No.: 6.503-5002.02-4
Issue: 1; 24.08.98
14486
3.9
± 0.05
Document Number: 81047
Rev. 1.8, 04-Sep-08
For technical questions, contact: emittertechsupport@vishay.com
www.vishay.com
263
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Revision: 08-Feb-17
1
Document Number: 91000