350 MHz to 4.0 GHz Quadrature Modulator, 1.5V common-mode voltage 24-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC24,.16SQ,20 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Description | 350 MHz to 4.0 GHz Quadrature Modulator, 1.5V common-mode voltage |
| JESD-30 代码 | S-PQCC-N24 |
| JESD-609代码 | e4 |
| 长度 | 4 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC24,.16SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大压摆率 | 235 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| Base Number Matches | 1 |
| TRF370315IRGET | TRF370315IRGER | TRF370333IRGER | TRF370333IRGETG4 | |
|---|---|---|---|---|
| 描述 | 350 MHz to 4.0 GHz Quadrature Modulator, 1.5V common-mode voltage 24-VQFN -40 to 85 | 350 MHz to 4.0 GHz Quadrature Modulator, 1.5V common-mode voltage 24-VQFN -40 to 85 | 350 MHz to 4.0 GHz Quadrature Modulator, 3.3V common-mode voltage 24-VQFN -40 to 85 | 350 MHz to 4.0 GHz Quadrature Modulator, 3.3V common-mode voltage 24-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 |
| 针数 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compli | compli |
| JESD-30 代码 | S-PQCC-N24 | S-PQCC-N24 | S-PQCC-N24 | S-PQCC-N24 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 4 mm | 4 mm | 4 mm | 4 mm |
| 湿度敏感等级 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | LCC24,.16SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大压摆率 | 235 mA | 235 mA | 235 mA | 0.235 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4 mm | 4 mm | 4 mm | 4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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