1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFN |
| 包装说明 | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
| 针数 | 12 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 标称带宽 | 22 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| JESD-30 代码 | S-XQCC-N12 |
| JESD-609代码 | e0 |
| 长度 | 4 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 12 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.025 W |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC12,.16SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大压摆率 | 5 mA |
| 最大供电电压 (Vsup) | 1.8 V |
| 最小供电电压 (Vsup) | 0.9 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4 mm |
| Base Number Matches | 1 |
| MAX9721BETC | MAX9721 | MAX9721AEBC-T | MAX9721AETC | MAX9721BEBC-T | MAX9721CEBC-T | MAX9721CETC | |
|---|---|---|---|---|---|---|---|
| 描述 | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown | 1V, Fixed-Gain, DirectDrive, Stereo Headphone Amplifier with Shutdown |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 零件包装代码 | QFN | - | BGA | QFN | BGA | BGA | - |
| 包装说明 | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 | - | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 | - |
| 针数 | 12 | - | 12 | 12 | 12 | 12 | - |
| Reach Compliance Code | _compli | - | _compli | _compli | _compli | _compli | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 标称带宽 | 22 kHz | - | 22 kHz | 22 kHz | 22 kHz | 22 kHz | - |
| 商用集成电路类型 | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - |
| JESD-30 代码 | S-XQCC-N12 | - | R-PBGA-B12 | S-XQCC-N12 | R-PBGA-B12 | R-PBGA-B12 | - |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | - |
| 长度 | 4 mm | - | 2.02 mm | 4 mm | 2.02 mm | 2.02 mm | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | - |
| 信道数量 | 2 | - | 2 | 2 | 2 | 2 | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | - |
| 端子数量 | 12 | - | 12 | 12 | 12 | 12 | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 标称输出功率 | 0.025 W | - | 0.025 W | 0.025 W | 0.025 W | 0.025 W | - |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | HVQCCN | - | VFBGA | HVQCCN | VFBGA | VFBGA | - |
| 封装等效代码 | LCC12,.16SQ,32 | - | BGA12,3X4,20 | LCC12,.16SQ,32 | BGA12,3X4,20 | BGA12,3X4,20 | - |
| 封装形状 | SQUARE | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | 245 | - | 245 | 245 | 245 | 245 | - |
| 电源 | 1.5 V | - | 1.5 V | 1.5 V | 1.5 V | 1.5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.8 mm | - | 0.67 mm | 0.8 mm | 0.67 mm | 0.67 mm | - |
| 最大压摆率 | 5 mA | - | 5 mA | 5 mA | 5 mA | 5 mA | - |
| 最大供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 最小供电电压 (Vsup) | 0.9 V | - | 0.9 V | 0.9 V | 0.9 V | 0.9 V | - |
| 表面贴装 | YES | - | YES | YES | YES | YES | - |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | NO LEAD | - | BALL | NO LEAD | BALL | BALL | - |
| 端子节距 | 0.8 mm | - | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | QUAD | - | BOTTOM | QUAD | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 4 mm | - | 1.54 mm | 4 mm | 1.54 mm | 1.54 mm | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - | - |
Linux与安卓
嵌入式系统
模拟电子
移动便携
嵌入式系统
DSP 与 ARM 处理器
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
