EEPROM, 64X16, Serial, CMOS, PDIP8,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 1164789410 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
数据保留时间-最小值 | 10 |
耐久性 | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e0 |
内存密度 | 1024 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
端子数量 | 8 |
字数 | 64 words |
字数代码 | 64 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 64X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
电源 | 5 V |
认证状态 | Not Qualified |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.000002 A |
最大压摆率 | 0.005 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
写保护 | SOFTWARE |
IS93C46SPM | IS93C46SP | IS93C46-3SJ | IS93C46-3SJI | IS93C46-3SJM | |
---|---|---|---|---|---|
描述 | EEPROM, 64X16, Serial, CMOS, PDIP8, | EEPROM, 64X16, Serial, CMOS, PDIP8, | EEPROM, 64X16, Serial, CMOS, PDSO8, | EEPROM, 64X16, Serial, CMOS, PDSO8, | EEPROM, 64X16, Serial, CMOS, PDSO8, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Objectid | 1164789410 | 1164789411 | 1164789402 | 1164789400 | 1164789401 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C |
数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 85 °C | 125 °C |
最低工作温度 | -55 °C | - | - | -40 °C | -55 °C |
组织 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP | SOP |
封装等效代码 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 5 V | 5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大待机电流 | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
最大压摆率 | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
表面贴装 | NO | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
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