Standard SRAM, 2KX8, 200ns, MOS, CDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Objectid | 101249052 |
包装说明 | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 200 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
内存密度 | 16384 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
端子数量 | 24 |
字数 | 2048 words |
字数代码 | 2000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2KX8 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大压摆率 | 0.08 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | MOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
SYD2129L-4 | SYC2129L-3 | SYD2129-3 | SYD2129L-3 | SYC2129-4 | SYC2129L-4 | SYD2129-4 | |
---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 2KX8, 200ns, MOS, CDIP24 | Standard SRAM, 2KX8, 150ns, MOS, CDIP24 | Standard SRAM, 2KX8, 150ns, MOS, CDIP24 | Standard SRAM, 2KX8, 150ns, MOS, CDIP24 | Standard SRAM, 2KX8, 200ns, MOS, CDIP24 | Standard SRAM, 2KX8, 200ns, MOS, CDIP24 | Standard SRAM, 2KX8, 200ns, MOS, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Objectid | 101249052 | 101249030 | 101249040 | 101249032 | 101249057 | 101249050 | 101249059 |
包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 200 ns | 150 ns | 150 ns | 150 ns | 200 ns | 200 ns | 200 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 0.08 mA | 0.08 mA | 0.1 mA | 0.08 mA | 0.1 mA | 0.08 mA | 0.1 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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