Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IKW75N60T
MA000920374
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
9.402
3.972
1.192
3967.074
17.489
19.848
377.121
1587.876
31.874
29.065
0.765
1.913
4.974
Average
Mass
[%]
0.16
0.07
0.02
65.54
0.29
0.33
6.23
26.23
0.53
0.48
0.01
0.03
0.08
29. August 2013
6052.57 mg
Sum
[%]
0.16
Average
Mass
[ppm]
1553
656
197
65.63
0.29
655437
2890
3279
62308
32.79
0.53
0.48
262348
5266
4802
126
316
0.12
822
1264
1000000
327935
5266
4802
656290
2890
Sum
[ppm]
1553
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
FPGA/CPLD
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