Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SPB18P06P G
MA000723242
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
2.472
0.304
0.091
304.026
2.794
10.312
113.432
563.721
9.657
0.228
0.001
0.055
0.044
2.102
0.548
0.165
547.666
Average
Mass
[%]
0.16
0.02
0.01
19.52
0.18
0.66
7.28
36.20
0.62
0.01
0.00
0.00
0.00
0.13
0.04
0.01
35.16
29. August 2013
1557.62 mg
Sum
[%]
0.16
Average
Mass
[ppm]
1587
195
59
19.55
0.18
195187
1794
6620
72824
44.14
0.62
361911
6200
147
0.01
1
35
28
0.13
1349
352
106
35.21
351605
352063
1000000
1412
147
441356
6200
195441
1794
Sum
[ppm]
1587
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com