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TSI721: 产品描述This document uses the following conventions; 文件大小403KB，共69页; 制造商IDT(艾迪悌); 官网地址http://www.idt.com/

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TSI721概述

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Titl

Tsi721

™

Datasheet

Formal Status

May 5, 2014

Table of Contents

About this Document......................................................................................................................7

Overview.................................................................................................................................................................................................... 7

Document Conventions.............................................................................................................................................................................. 7

Revision History......................................................................................................................................................................................... 8

Device Overview.......................................................................................................................... 10

1.1

1.2

Features................................................................................................................................................................................................... 10

1.2.1

PCIe Features .......................................................................................................................................................................... 10

1.2.2

S-RIO Features .........................................................................................................................................................................11

1.2.3

Bridging Features ......................................................................................................................................................................11

1.2.4

Messaging Features ................................................................................................................................................................. 12

1.2.5

Block DMA Engine Features .................................................................................................................................................... 12

1.2.6

Miscellaneous Features............................................................................................................................................................ 13

1.3

Block Diagram.......................................................................................................................................................................................... 14

1.3.1

PCIe Interface........................................................................................................................................................................... 14

1.3.2

S-RIO Interface......................................................................................................................................................................... 14

1.3.3

Messaging Engine.................................................................................................................................................................... 14

1.3.4

Mapping Engine........................................................................................................................................................................ 14

1.3.5

Block DMA Engine.................................................................................................................................................................... 14

1.4

Typical Applications ................................................................................................................................................................................. 15

1.4.1

Defense/Aerospace Application ............................................................................................................................................... 15

1.4.2

Video and Imaging Application ................................................................................................................................................. 17

1.4.3

Wireless Application ................................................................................................................................................................. 17

Signals ......................................................................................................................................... 19

2.1

2.2

Ballmap.................................................................................................................................................................................................... 20

2.3

Pinlist ....................................................................................................................................................................................................... 21

2.4

PCIe Signals ............................................................................................................................................................................................ 21

2.5

S-RIO Signals .......................................................................................................................................................................................... 22

2.6

General Signals ....................................................................................................................................................................................... 22

2.7

I2C Signals .............................................................................................................................................................................................. 23

2.8

JTAG and Test Interface Signals.............................................................................................................................................................. 23

2.9

GPIO Signals ........................................................................................................................................................................................... 24

2.10 Power-up Signals..................................................................................................................................................................................... 25

2.11 Power Supply Signals.............................................................................................................................................................................. 28

Electrical Characteristics ........................................................................................................... 29

3.1

Absolute Maximum Ratings ..................................................................................................................................................................... 29

3.2

Recommended Operating Conditions...................................................................................................................................................... 30

3.3

Power Consumption................................................................................................................................................................................. 30

3.4

Power Supply Sequencing....................................................................................................................................................................... 31

May 5, 2014

Tsi721 Datasheet

Formal Status

Integrated Device Technology

This document is confidential and is subject to an NDA.

Table of Contents

3.5

3.6

3.7

3.4.1

Power-Up Sequencing.............................................................................................................................................................. 31

3.4.2

Power-Down Sequencing ......................................................................................................................................................... 31

DC Operating Characteristics .................................................................................................................................................................. 32

Decoupling Recommendation.................................................................................................................................................................. 33

AC Timing Specifications ......................................................................................................................................................................... 33

3.7.1

PCIe Differential Receiver Specifications ................................................................................................................................. 33

3.7.2

PCIe Differential Transmitter Specifications ............................................................................................................................. 36

3.7.3

RapidIO SerDes Characteristics............................................................................................................................................... 40

3.7.4

Level I Long Run Transmitter Specifications ............................................................................................................................ 45

3.7.5

Reference Clocks – PCCLKP/N and REFCLKP/N ................................................................................................................... 59

3.7.6

JTAG and Test Interface Signal Timings .................................................................................................................................. 61

3.7.7

I2C Interface Signal Timings .................................................................................................................................................... 62

3.7.8

GPIO Interface Signal Timings ................................................................................................................................................. 63

3.7.9

RSTn Signal Timings................................................................................................................................................................ 63

Package Specifications............................................................................................................... 64

4.1

Package Dimensions ............................................................................................................................................................................... 64

4.2

Package Diagrams................................................................................................................................................................................... 65

4.3

Thermal Characteristics........................................................................................................................................................................... 66

4.4

Moisture Sensitivity.................................................................................................................................................................................. 66

Ordering Information ................................................................................................................... 67

Tsi721 Datasheet

May 5, 2014

Formal Status

Integrated Device Technology

This document is confidential and is subject to an NDA.

List of Figures

Figure 1:

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Figure 4:

Figure 5:

Figure 6:

Figure 7:

Figure 8:

Figure 9:

Figure 10:

Figure 11:

Figure 12:

Figure 13:

Figure 14:

Figure 15:

Figure 16:

Figure 17:

Defense/Aerospace Application ................................................................................................................................................................ 16

Video and Imaging Application ................................................................................................................................................................. 17

Wireless Application .................................................................................................................................................................................. 18

Ballmap ....................................................................................................................................................................................................... 20

S-RIO Definition of Transmitter Amplitude and Swing ................................................................................................................................ 41

S-RIO Transition Symbol Transmit Eye Mask............................................................................................................................................. 46

S-RIO Single Frequency Sinusoidal Jitter Limits ........................................................................................................................................ 48

S-RIO Level I Receiver Input Mask............................................................................................................................................................. 49

Transition and Steady State Symbol Eye Mask .......................................................................................................................................... 53

Level II Receiver Input Compliance Mask................................................................................................................................................... 58

HCSL to REFCLKP/N / PCCLKP/N ............................................................................................................................................................ 60

LVDS to REFCLKP/N / PCCLKP/N............................................................................................................................................................. 60

LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 60

LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 61

I2C Interface Signal Timings....................................................................................................................................................................... 62

Package Diagrams...................................................................................................................................................................................... 65

Tsi721 Datasheet

May 5, 2014

Formal Status

Integrated Device Technology

This document is confidential and is subject to an NDA.

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器件捷径: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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