Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
SPU07N60C3
MA000851458
PG-TO251-3-21
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
Substances
silicon
tin
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7440-31-5
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
4.883
0.273
181.882
1.257
1.316
2.751
3.110
22.729
89.718
3.976
0.344
0.098
0.078
3.742
0.011
0.036
36.124
Average
Mass
[%]
1.39
0.08
51.63
0.36
0.37
0.78
0.88
6.45
25.46
1.13
0.10
0.03
0.02
1.06
0.00
0.01
10.25
29. August 2013
352.33 mg
Sum
[%]
1.39
Average
Mass
[ppm]
13858
776
51.71
0.36
516229
3567
3735
7809
8828
64509
33.94
1.13
0.10
254643
11284
977
278
222
1.11
10622
31
103
10.26
102529
102663
1000000
11122
339524
11284
977
517005
3567
Sum
[ppm]
13858
leadfinish
plating
solder
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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