Two 1-Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port, Fdbk Path and Selectable Polarity 20-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | GTLP |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | CONFIGURABLE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 20 mA |
| 传播延迟（tpd） | 6.3 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | GTLP & LVTTL |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| SN74GTLP1395DWR | SN74GTLP1395PW | SN74GTLP1395PWE4 | SN74GTLP1395PWR | SN74GTLP1395PWRE4 | SN74GTLP1395DWRE4 | |
|---|---|---|---|---|---|---|
| 描述 | Two 1-Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port, Fdbk Path and Selectable Polarity 20-SOIC -40 to 85 | Two 1-Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port, Fdbk Path and Selectable Polarity 20-TSSOP -40 to 85 | Translation - Voltage Levels 2 1-Bit LVTTL/GTLP Bus Xcvr Adj-Eg-Rate | Two 1-Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port, Fdbk Path and Selectable Polarity 20-TSSOP -40 to 85 | Translation - Voltage Levels Quad Bus Buffer Gate With 3-State Outputs | Translation - Voltage Levels Quad Bus Buff Gate W/3-St Otpt |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | TSSOP | TSSOP | TSSOP | TSSOP | SOIC |
| 包装说明 | SOP, SOP20,.4 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | SOP, SOP20,.4 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | unknow | compliant | unknow | unknow |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | GTLP | GTLP | GTLP | GTLP | GTLP | GTLP |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 12.8 mm | 6.5 mm | 6.5 mm | 6.5 mm | 6.5 mm | 12.8 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.1 A | 0.024 A | 0.1 A | 0.1 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | TSSOP | TSSOP | SOP |
| 封装等效代码 | SOP20,.4 | TSSOP20,.25 | TSSOP20,.25 | TSSOP20,.25 | TSSOP20,.25 | SOP20,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 包装方法 | TR | TUBE | TUBE | TR | TR | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最大电源电流（ICC） | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| 传播延迟（tpd） | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
| 最小供电电压 (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 翻译 | GTLP & LVTTL | GTLP & LVTTL | GTLP & LVTTL | GTLP & LVTTL | GTLP & LVTTL | GTLP & LVTTL |
| 宽度 | 7.5 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 7.5 mm |
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