PPTC/SM Series
Features
Surface Mount Devices
Lead free deivce
Size 7555mm/2920 mils
Surface Mount packaging for automated assembly
Agency recognition:
Applications
Almost anywhere there is a low voltage
power supply, up to DC60V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
Dimensions (mm)
A
2. ±0.
3
1
2. ±0.
3
1
B
5. ±0.
1
1
D
C
Product dimensions (mm)
Model
min
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM250
SM260
SM300
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
A
max
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
min
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
B
max
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
min
0.60
0.60
0.60
0.40
0.40
0.40
0.30
0.30
0.30
0.30
0.60
C
max
1.30
1.30
1.30
1.00
0.90
0.90
0.90
0.90
0.90
0.90
1.30
D
min
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Conditions
Resistance change
85℃,1000hrs
±5% typical
±5% typical
±33% typical
No change
85℃,85%℃R.H.,168hrs
85℃,to-40℃,13times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
No change
Ambient operating confitions:-40℃
to 85℃
Maximum surface of the device in the tripped state is 125℃
REV.2014.05.01
5. ±0.
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1
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ZZZL
PPTC/SM Series
Electrical characteristics(25℃)
Model
Ihold
(A)
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM250
SM260
SM300
Ihold
Itrip
Vmax
Imax
Pd
Rmin/max
R1max
*CAUTION
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
3.00
Itrip
(A)
0.60
1.00
1.50
2.20
2.50
3.00
3.70
4.00
5.00
5.20
6.00
Vmax
(Vdc)
60
60
33
33
33
33
33
16
16
6
16
Imax
(A)
100
100
100
100
100
100
100
100
100
100
100
Pd max
(w)
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
Maximum Time To Trip
Current
Time
(A)
(S)
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
3.0
4.0
0.3
0.5
2.0
2.0
2.5
4.5
16.0
10.0
20.0
Resistance
Rmin
Rmax
(Ω
)
(Ω
)
0.600
0.180
0.100
0.065
0.050
0.035
0.030
0.020
0.020
0.014
0.012
4.800
1.400
1.000
0.410
0.250
0.230
0.150
0.120
0.085
0.075
0.048
Hold Current:Maximum current device will not trip in 25℃ still air.
Trip current:Minimum current at which the device will always trip in 25℃ still air
Maximum operating volatge device can withstand without damage at ratde current(imax).
Maximum fault current device can withstand without damage at rated voltage(Vmax).
Typical power dissipatde from device when in the tripped state in 25℃ still air.
Minimum/Maximum device resistance prior to tripping at 25℃.
Maximum resistance of device at 25℃ measured one hour after trippde tripping.
Operation beyond the specified rating may result in damage and possible arcing.
Ihold versus tempetature
maximun ambient operating temperature(Tmao)vs.hold current(Ihold)
Model
SM030
SM050
SM075
SM100
SM125
SM150
SM185
SM200
SM250
SM260
SM300
—40℃
0.45
0.76
1.13
1.66
1.89
2.27
2.80
3.02
3.78
3.64
4.53
—20℃
0.40
0.67
1.01
1.47
1.68
2.01
2.47
2.68
3.35
3.25
4.02
0℃
0.35
0.59
0.88
1.29
1.46
1.76
2.17
2.34
2.93
2.91
3.51
25℃
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
3.00
40℃
0.25
0.42
0.62
0.91
1.04
1.25
1.54
1.66
2.08
2.26
2.52
50℃
0.23
0.38
0.56
0.83
0.94
1.13
1.39
1.50
1.88
2.08
2.26
60℃
0.20
0.33
0.50
0.73
0.83
1.00
1.22
1.32
1.65
1.95
1.99
85℃
0.14
0.23
0.34
0.50
0.56
0.74
0.85
0.90
1.13
1.13
1.34
REV.2014.05.01
02 | www.spsemi.cn
PPTC/SM Series
Termination pad characteristics
Terminal pad materials
Terminal pad solderability
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Thermal Derating Curve
Derating Curves for SMD Series
160
Typical Time-To-Trip At 25°
C
Average Time Current Curves
100
3.00A
0.50A
Percentage of Derated
Current
140
10
Time In Seconds
0.75A
1.00A
120
1.25A
100
80
60
40
20
0
-40
-20
0
20
40
60
80
1.5A
1.85A
1
2.0A
2.5A
2.6A
0.1
0.3A
0.01
0.
1
1
Current In Amperes
Temperature (°
C)
10
100
Temperature(°
C)
SMD Series
Preheating
SM
300
250
200
190
160
100
0
60-120
sec.
Recommended Solder Reflow Conditions
Soldering
Cooling
‧Recommended
reflow methods：IR, vapor phase oven, hot air oven.
‧Devices
are not designed to be wave soldered to the bottom side
of the board.
‧Recommended
maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices
can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
30-60
sec.
120
sec.
Package Information
Reel:
SM030½300
2000pcs/Reel
REV.2014.05.01
03 | www.spsemi.cn
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