Doc. No
TAI004 Series
Approval Specification Sheet
for TA-I
TA-I Technology Inc.
Issued date
Page
2012/08/22
1 /6
LED Heat Dissipation Substrate Approval
Specification Sheet for TA-I 004 Series
TA-I Technology Part Number: LHA01APTAI004 Series
Customer Approval:
Valid Date
Aug 22 , 2012
Approved by
Release Date
Aug 22 , 2012
Checked by
Version
TAI004 Series
Produced by
N0.26, LANE 470, NAN-SHAN Rd., SEC.2,LU-CHU HSIANG, TAOYUAN, TAIWAN, R. O. C.
TEL：886-3-3246169
FAX：886-3-3246167
TA-I TECHNOLOGY CO., LTD
Doc. No
TAI004 Series
Approval Specification Sheet
for TA-I
TA-I Technology Inc.
Issued date
Page
2012/08/22
2 /6
1. Specification：
1.1 Substrate Dimension as shown in Table 1.
1.2 Per panel up to 312 pieces.
Table 1: The spec of Panel and Single Unit
Item
Spec
Length
109.2±0.1
Width
54.6±0.1
Panel
Thickness of substrate
0.38±0.04
The total thickness
0.53±0.025
Length
3.5±0.02
Single Unit
Width
3.5±0.02
Unit: mm
1.3 Specification of Panel:
TA-I TECHNOLOGY CO., LTD
Doc. No
TAI004 Series
Approval Specification Sheet
for TA-I
TA-I Technology Inc.
Issued date
Page
2012/08/22
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2.
Electrical Continuity Test:
2.1 Test point: As shown in below diagram.
2.2 Method: Use flying probe attach separately to IO1 / IO2 of front side and WB1/WB2 of back
side, result shall as shown as Table 1 and all via holes plugged. Electrodes of IO1/WB1 and
IO2/WB2 shall be isolated from each other.
WB1
IO1
WB2
IO2
Front Side – Bondpad Area
2.3 Table of electrical function:
IO1-WB1
Measurement area
Function of electrical
○
○:
Closed,
╳:
Opened
Back Side – Non-Critical Area
IO2-WB2
○
WB1-WB2
╳
IO1-IO2
╳
TA-I TECHNOLOGY CO., LTD
Doc. No
TAI004 Series
Approval Specification Sheet
for TA-I
TA-I Technology Inc.
Issued date
Page
2012/08/22
4 /6
3. Criteria of Visual Inspection:
3.1 Visual inspection
3.2 Test items are shown as below table.
3.3 Tool: CCD OM 15X
3.4 Panel defective control: Accept if defective </= 10%
3.5 Definition of test areas:
No.
Item
Examine area Specification
a)Depression
b)Silver Point
c)Protrusion
d)Foreign
Single unit of
NG if
Materials
front and back
>/= 0.8mm
e)Contaminants
side
f)Crack
g)Peeling
(Electroless &
Electro Plating)
Schematic diagram
1
Front Side
Back Side
2
Pattern
Inspection
The finish
pattern shall
Pattern of front
per original
and back side
drawing
(above 95%).
No metal /
photoresist in
indicated
area.
3
Plating Layer /
Photoresist
Gap edge of
bondpad area
4
Over Plating /
Partial Plating
Panel
Filling holes
ratio > 99%
5
Over Plating
Tooling hole
No metal
inside of the
tooling hole.
TA-I TECHNOLOGY CO., LTD
Doc. No
TAI004 Series
Approval Specification Sheet
for TA-I
TA-I Technology Inc.
Issued date
Page
2012/08/22
5 /6
4. Coating thickness test specification:
4.1 Using tools： Substrate thickness
Cu thickness
Cavity thickness
Final finish thickness
4.2 Measurement position:
Substrate thickness
: Micrometer
: 3 axis microscope
: Micrometer
: X-ray thickness meter
: Position 1
4.3 Inspect spec:
Cu thickness
: Position 2
Cavity thickness
: Position 3
Final finish thickness : Position 4
(Tree times average of measurement)
Substrate thickness
: 0.38±0.04mm
Cu thickness
: 65±10 um
Final finish thickness :
TAI004B :
Ag:0.5 (0.4~1.2)um (electroless)
TAI004C :
Ni: 5 (2~8) um
Pd: 0.1 (0.05~0.25) um
Au: 0.1 (0.05~0.25) um (electroless)
TAI004D :
Ag:0.5 (0.4~1.2)um (electroless)
TAI004E :
Ni: 5 (2~10) um
Ag: 3 (1.5~7) um (electroplate)
TAI004F:
Ni: 5 (2~8) um
Au: 0.3 (0.2~0.8) um (electroplate)
TAI004G:
Ni: 5 (2~8) um
Pd: 0.1 (0.05~0.25) um
Au: 0.1 (0.05~0.25) um (electroless)
Cavity thickness(Dry-film):0.1±0.02mm
1
1
2
2
4
3
4
TAI004B、C、D、E、F
TAI004G
TA-I TECHNOLOGY CO., LTD
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