Document No
TRF12OS002A
2010/07/09
1/7
Lead Free SMD Resettable Fuse
Issued date
Page
1. Scope
This specification applies for the Lead-Free SMD Resettable fuse series .
2. Construction
Style 1
Style 2
3. Type Designation
TRF
12
035
V06
E
F
2
Packaging
Lead
Free
E:Embossed Tape
T:Paper Tape
SMD
Resettable
fuse
Size
12:1206(3216)
I-hold
035:0.35A
Vmax(Vdc)
V06: 6V
V08: 8V
V12: 12V
V13: 13.2V
V15: 15V
V16: 16V
V30: 30V
V60: 60V
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Document No
TRF12OS002A
2010/07/09
2/7
Lead Free SMD Resettable Fuse
Issued date
Page
4. Dimensions
Style 1
Style 2
Dimensions
Unit: mm
Part
Designation
TRF12-012V30-EF
TRF12-020V24-EF
TRF12-020V30-EF
TRF12-035V06-EF
TRF12-035V16-EF
TRF12-050V13-EF
TRF12-075V06-EF
TRF12-110V06-EF
TRF12-150V06-EF
TRF12-200V06-EF
A
Min.
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
3.00
Max.
3.40
3.40
3.40
3.40
3.40
3.40
3.40
3.40
3.40
3.50
Min.
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.40
1.40
B
Max.
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
1.80
Min.
0.70
0.48
0.40
0.48
0.40
0.48
0.40
0.40
0.40
0.70
C
Max.
1.10
0.85
0.85
0.85
0.85
0.85
0.70
0.70
0.70
1.60
D
Min.
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Style
1
1
2
1
2
1
1
1
1
1
Packaging: 3000 pcs. per reel.
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Document No
TRF12OS002A
2010/07/09
3/7
Lead Free SMD Resettable Fuse
Issued date
Page
5. Applications and ratings
I
hold
at
23℃
(A)
0.12
0.20
0.20
0.35
0.35
0.50
0.75
1.10
1.50
2.00
I
trip
at
23℃
(A)
0.29
0.46
0.40
0.75
0.75
1.00
1.50
2.20
3.00
4.00
P
d
Typ.
(W)
0.4
0.6
0.6
0.6
0.6
0.4
0.4
0.6
0.6
0.7
Maximum
time to trip
at 23℃
Current Time
(A)
1
1
1
8
3.5
8
8
8
8
8
(Sec)
0.20
0.60
0.60
0.10
0.10
0.10
0.10
0.10
0.30
1.00
Resistance
at 23℃
Ri
min
(Ω)
1.35
0.60
0.60
0.30
0.30
0.15
0.10
0.06
0.03
0.02
R1
max
(Ω)
8.50
2.60
3.30
1.20
1.40
0.70
0.40
0.20
0.13
0.085
Part
Designation
TRF12-012V30-EF
TRF12-020V24-EF
TRF12-020V30-EF
TRF12-035V06-EF
TRF12-035V16-EF
TRF12-050V13-EF
TRF12-075V06-EF
TRF12-110V06-EF
TRF12-150V06-EF
TRF12-200V06-EF
V
max
(Vdc)
30
24
30
6
16
13.2
6
6
6
6
I
max
(A)
10
10
60
100
20
100
100
100
100
100
I
hold
= Hold Current. Maximum current device will sustain for 30min without tripping in 23°C still air.
I
trip
= Trip Current. Minimum current at which the device will trip in 23°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current.
I
max
= Maximum fault current device can withstand without damage at rated voltage.
P
d
= Power dissipated from device when in the tripped state at 23°C still air.
Ri
min
= Typical resistance of device in initial (un-soldered) state.
R1
max
= Maximum resistance of device at 23°C measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damge and possibile arcing and
flame.
6. Thermal Derating Chart
Maximum ambient operating temperature(T
mao
) vs. hold current (I
hold
) (Amps)
Part
Designation
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
0.17
0.15
0.12
0.11
0.10
0.09
0.08
0.07
TRF12-012V30-EF
0.19
0.27
0.24
0.20
0.18
0.16
0.14
0.12
0.11
TRF12-020V24-EF
0.30
0.27
0.24
0.20
0.18
0.16
0.14
0.12
0.10
TRF12-020V30-EF
0.30
0.46
0.40
0.35
0.30
0.27
0.24
0.22
0.18
TRF12-035V06-EF
0.51
0.51
0.44
0.35
0.31
0.28
0.24
0.21
0.16
TRF12-035V16-EF
0.58
0.68
0.59
0.50
0.44
0.40
0.35
0.32
0.26
TRF12-050V13-EF
0.76
1.00
0.85
0.75
0.67
0.61
0.52
0.50
0.42
TRF12-075V06-EF
1.11
1.46
1.30
1.10
0.92
0.83
0.80
0.65
0.52
TRF12-110V06-EF
1.64
1.99
1.77
1.50
1.34
1.23
1.10
1.01
0.84
TRF12-150V06-EF
2.20
2.61
2.28
2.00
1.80
1.66
1.51
1.39
1.19
TRF12-200V06-EF
2.88
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Document No
TRF12OS002A
2010/07/09
4/7
Lead Free SMD Resettable Fuse
Issued date
Page
7.
Typical Time to Trip at 23 °C
The Time to Trip curves represent typical performance of a device in a simulated application environment.
Actual performance in specific customer applications may differ from these values due to the influence of
other variables.
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Document No
TRF12OS002A
2010/07/09
5/7
Lead Free SMD Resettable Fuse
Issued date
Page
8. Environment
8.1 Operating Conditions
Operating Temperature: -40℃ to 85℃
Device Surface Temperature in Tripped State: 125℃ max
8.2 Environmental Specifications
TEST ITEM
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Condition
85℃,1000hr
85℃,85%R.H,1000hr
85℃ to -40℃,20times
MIL-STD-202,Method215
MIL-STD-883C,Method2007.1
Condition A
Resistance Change
±5%
typical
±5%
typical
±10%
typical
No change
No change
8.3 Solder Reflow Recommendations
‧Recommend
reflow methods : IR, vapor phase oven, hot air oven.
‧Devices
are not designed to be wave soldered to the bottom side
of the board.
‧Recommended
maximum paste thickness is 0.25 mm(0.010 inch).
‧Devices
can be cleaned using standard method and solvents.
Note : If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
TA-I TECHNOLOGY CO., LTD
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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