SURFACE MOUNT,
HIGH REPEATABILITY,
SIGNAL INTEGRITY TO 10Gpbs
BROADBAND TO-5 RELAYS
DPDT
SERIES
DESIGNATION
GRF300
GRF303
RELAY TYPE
Repeatable, Signal Integrity, RF TO-5 relay
Sensitive, Repeatable, Signal Integrity, RF TO-5 relay
DESCRIPTION
SERIES
GRF300
GRF303
INTERNAL CONSTRUCTION
UPPER STATIONARY
CONTACT
MOVING CONTACT
UNIFRAME
ARMATURE
LOWER STATIONARY
CONTACT
GROUND SHIELD
ENVIRONMENTAL AND
PHYSICAL SPECIFICATIONS
Temperature
(Ambient)
Storage
Operating
–65°C to +25°C
–55°C to +85°C
0 g’s to 500 Hz
30 g’s,
6ms half sine
Hermetically sealed
GRF300
GRF303
0.09 oz. (2.55g) max.
0.6 oz. (4.5g) max.
The ultraminiature GRF300 and GRF303 relays are designed
to provide a practical surface-mount solution with improved
RF signal repeatability over the frequency range. GRF300
and GRF303 relays feature a unique ground shield that
isolates and shields each lead to ensure excellent contact-
to-contact and pole-to-pole isolation.
The GRF300/GRF303
version with the improved ground connections can
push the performance up into the 10Gbps data rates for
digital signal integrity applications.
This ground shield
provides a ground interface that results in improved high-
frequency performance as well as parametric repeatability.
The GRF300 and GRF303 extend performance advantages
over similar RF devices that simply offer formed leads for
surface mounting. These relays are engineered for use in RF
attenuator, RF switch matrices, ATE and other applications
that require dependable high frequency signal fidelity and
performance.
The GRF300 and GRF303 feature:
• High repeatability
• Broader bandwidth
• Metal enclosure for EMI shielding
• High isolation between control and signal paths
• High resistance to ESD
The following unique construction features and manufacturing
techniques provide excellent robustness to environmental
extremes and overall high reliability:
• Uniframe motor design provides high magnetic efficiency
and mechanical rigidity
• Minimum mass components and welded construction
provide maximum resistance to shock and vibration
• Advanced cleaning techniques provide maximum
assurance of internal cleanliness
• Gold-plated precious metal alloy contacts ensure reliable
switching
• Hermetically sealed
GRF300/GRF303 Page
GRF300GRF303\072007\Q
Vibration
(General Note )
Shock
(General Note )
Enclosure
Weight
© 2007 TELEDYNE RELAYS
SERIES GRF300 AND GRF303
GENERAL ELECTRICAL SPECIFICATIONS (@25°C unless otherwise noted) (Notes 2 & 3)
Contact Arrangement
Rated Duty
Contact Resistance
Contact Load Rating
Contact Life Ratings
GRF300-5
Coil Operating Power
GRF300-12
GRF303-5
GRF303-12
Operate Time
Release Time
Intercontact Capacitance
Insulation Resistance
Dielectric Strength
GRF300
GRF303
GRF300
GRF303
2 Form C (DPDT)
Continuous
0.5
Ω
max.
Resistive: Amp/28Vdc
Low level: 0 to 50
μA
@ 0 to 50mV
0,000,000 cycles (typical) at low level
500 mw typical @ nominal rated voltage
370 mw typical @ nominal rated voltage
250 mw typical @ nominal rated voltage
69 mw typical @ nominal rated voltage
4.0 msec max.
6.0 msec max.
3.0 msec max.
3.0 msec max.
0.4 pf typical
,000 MΩ min. between mutually isolated terminals
350 Vrms/60Hz @ atmospheric pressure
DETAILED ELECTRICAL SPECIFICATIONS (@25°C)
BASE PART NUMBERS
Coil Voltage, Nominal (Vdc)
Coil Resistance
(Ohms ±20%)
Pick-up Voltage (Vdc, Max.)
GRF300
GRF303
GRF300-5
GRF303-5
GRF300-12
GRF303-12
5.0
50
00
3.6
2.0
390
850
9.0
GENERAL NOTES
. Relays will exhibit
no contact chatter in
excess of 0 µsec or
transfer in excess of
µsec.
2. Unless otherwise
specified, parameters
are initial values.
3. Relays may be
subjected to 260°C,
peak solder reflow
temperature, minute, 3
passes.
4. Butt-lead ends are
coplanar within
.003" (0.08mm).
5. Application notes
available for PCB
layout and mounting
information.
OUTLINE DIMENSIONS
.335 MAX
(8.51)
.425 MAX
(10.6)
(GRF313)
.315 MAX
(8)
(GRF300)
SEE NOTE 3
.035 REF
(.89)
.375 MAX
(9.52)
6 LEADS
LENGTH
.033 (0.84) REF
.031 (.79)
REF
DIA.
.017
(0.43)
.035 (.89)
REF
+.002
-.001
+0.05
-0.03
U.S. PATENT PENDING
36° ±3° TYP
.200 ±.010
(5.98 ±0.25)
DIA.
NOTES:
1. DIMENSIONS ARE IN INCHES.
METRIC EQUIVALENTS IN
MILLIMETERS ARE SHOWN IN ( ).
2. UNLESS OTHERWISE SPECIFIED,
TOLERANCES ON DIMENSIONS
ARE ±.010 INCH (0.025 mm).
3. FOR OPTIMAL RF PERFORMANCE,
SOLDER BOTTOM OF GROUND
SHIELD TO PCB RF GROUND
PLANE.
9
8
7
6
1
2
3
4
SCHEMATIC - TERMINAL VIEW
PIN NUMBERS ARE FOR REFERENCE ONLY;
NOT MARKED ON RELAY
© 2007 TELEDYNE RELAYS
GRF300/GRF303 Page 5
GRF300GRF303\072007\Q
FPGA/CPLD
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