Ceramic Capacitor, Multilayer, Ceramic, 25V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| Objectid | 1795198300 |
| 包装说明 | , 0402 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 电容 | 2e-7 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| JESD-609代码 | e3 |
| 安装特点 | SURFACE MOUNT |
| 多层 | Yes |
| 端子数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE |
| 包装方法 | TR, PAPER, 13 INCH |
| 额定（直流）电压（URdc） | 25 V |
| 尺寸代码 | 0402 |
| 表面贴装 | YES |
| 温度特性代码 | C0G |
| 温度系数 | -/+30ppm/Cel ppm/°C |
| 端子面层 | Tin (Sn) - with Nickel (Ni) barrier |
| 端子形状 | WRAPAROUND |
| HH15N0R2C250LG | HH15N0R2C250LT | HH15N0R2C160LT | HH15N0R2C500LT | HH15N0R2C160LG | HH15N0R2B160LG | HH15N0R2B160LT | HH15N0R2B500LG | HH15N0R2B500LT | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Ceramic Capacitor, Multilayer, Ceramic, 25V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 25V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 16V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 16V, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 16V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 16V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE | Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 50% -Tol, C0G, 30ppm/Cel TC, 0.0000002uF, Surface Mount, 0402, CHIP, LEAD FREE |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Objectid | 1795198300 | 1795198301 | 1795198299 | 1795198303 | 1795198298 | 1795198292 | 1795198293 | 1795198296 | 1795198297 |
| 包装说明 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 | , 0402 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 电容 | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF | 2e-7 µF |
| 电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| 多层 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| 端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
| 包装方法 | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 7 INCH | TR, PAPER, 7 INCH | TR, PAPER, 13 INCH | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH |
| 额定（直流）电压（URdc） | 25 V | 25 V | 16 V | 50 V | 16 V | 16 V | 16 V | 50 V | 50 V |
| 尺寸代码 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 | 0402 |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度特性代码 | C0G | C0G | C0G | C0G | C0G | C0G | C0G | C0G | C0G |
| 温度系数 | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C |
| 端子面层 | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) - with Nickel (Ni) barrier |
| 端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
