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ADC-HZ12BMM

产品描述ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32
产品类别模拟混合信号IC    转换器   
文件大小169KB,共7页
制造商Murata Power Solutions
下载文档 详细参数 选型对比 全文预览

ADC-HZ12BMM概述

ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32

ADC-HZ12BMM规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid1809510554
零件包装代码DIP
包装说明DIP, DIP32,.9
针数32
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最大模拟输入电压10 V
最小模拟输入电压-10 V
最长转换时间8 µs
转换器类型ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码R-CDIP-T32
JESD-609代码e4
最大线性误差 (EL)0.0244%
标称负供电电压-15 V
模拟输入通道数量1
位数12
功能数量1
端子数量32
最高工作温度125 °C
最低工作温度-55 °C
输出位码COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
输出格式SERIAL, PARALLEL, WORD
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP32,.9
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5,+-15 V
认证状态Not Qualified
座面最大高度5.969 mm
标称供电电压15 V
表面贴装NO
技术HYBRID
温度等级MILITARY
端子面层GOLD (50) OVER NICKEL (100)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度22.86 mm

ADC-HZ12BMM相似产品对比

ADC-HZ12BMM ADC-HX12BGC ADC-HX12BMM-QL ADC-HZ12BMC ADC-HX/883 ADC-HZ12BGC ADC-HX12BMC
描述 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Serial, Parallel, Word Access, Hybrid, CDIP32, CERAMIC, TDIP-32
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP DIP DIP DIP DIP DIP DIP
包装说明 DIP, DIP32,.9 DIP, DIP32,.9 DIP, DIP32,.9 DIP, DIP32,.9 DIP, DIP32,.9 DIP, DIP32,.9 DIP, DIP32,.9
针数 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A001.A.2.C EAR99 3A001.A.2.C EAR99 3A001.A.2.C EAR99 EAR99
最大模拟输入电压 10 V 10 V 10 V 10 V 10 V 10 V 10 V
最小模拟输入电压 -10 V -10 V -10 V -10 V -10 V -10 V -10 V
最长转换时间 8 µs 20 µs 20 µs 8 µs 20 µs 8 µs 20 µs
转换器类型 ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32 R-CDIP-T32
JESD-609代码 e4 e4 e4 e4 e4 e4 e4
最大线性误差 (EL) 0.0244% 0.0244% 0.0244% 0.0244% 0.0244% 0.0244% 0.0244%
标称负供电电压 -15 V -15 V -15 V -15 V -15 V -15 V -15 V
模拟输入通道数量 1 1 1 1 1 1 1
位数 12 12 12 12 12 12 12
功能数量 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32
最高工作温度 125 °C 70 °C 125 °C 70 °C 125 °C 70 °C 70 °C
输出位码 COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT, COMPLEMENTARY OFFSET BINARY
输出格式 SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD SERIAL, PARALLEL, WORD
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP DIP DIP DIP DIP DIP
封装等效代码 DIP32,.9 DIP32,.9 DIP32,.9 DIP32,.9 DIP32,.9 DIP32,.9 DIP32,.9
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.969 mm 5.969 mm 5.969 mm 5.969 mm 5.969 mm 5.969 mm 5.969 mm
标称供电电压 15 V 15 V 15 V 15 V 15 V 15 V 15 V
表面贴装 NO NO NO NO NO NO NO
技术 HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID
温度等级 MILITARY COMMERCIAL MILITARY COMMERCIAL MILITARY COMMERCIAL COMMERCIAL
端子面层 GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100) GOLD (50) OVER NICKEL (100)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 22.86 mm 22.86 mm 22.86 mm 22.86 mm 22.86 mm 22.86 mm 22.86 mm

 
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