MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Features
♦
♦
♦
♦
♦
♦
♦
♦
♦
Operating Freq. 10 ± 2GHz or 24 ± 2GHz
Surface Mount Device
Integrated Bias Network
No Wire Bonds Required
Low Current Consumption
+12 mA for On State/0V for Off Condition
Rugged, Glass Encapsulated Construction
Fully Monolithic
Polymer Scratch Protection
RoHS Compliant
Description
The MASW-004240-13170W is a surface mount
SP4T switch chip with integrated bias network. It
utilizes M/A-COM technology Solutions HMIC
TM
(Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310, which allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in
low loss, low dispersion glass. By using small
spacing between elements, this combination of
silicon and glass gives HMIC devices low loss and
high isolation performance with exceptional
repeatability through low millimeter frequencies.
Patterned gold backside metal allows for manual
or re-flow soldering without the need for wire bond
connections to the RF and bias ports. The chip
may be soldered using 80Au/20Sn, RoHS
compliant solders or electrically conductive silver
epoxy. The RF bond pads are labeled J1-J5 and
are 375x375µM (15x15mils) square. The DC bias
bond pads are labeled B2-B5 and are also
375x375µM (15x15mils) square.
Yellow areas denote backside soldering points
for bias and RF connections.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Forward Current
RF Incident Power
Mounting Temperature
Absolute Maximum
-65
o
C to +125
o
C
-65
o
C to +150
o
C
+175
o
C
+40mA
+30dBm C.W.
+280
o
C for 10 Seconds
Applications
The MASW-004240-13170W has been designed for
24GHz automotive radar sensor applications and is
also ideally suited for use at 10GHz. The switch is
turned on by applying a forward current of +12mA
at 4V to the appropriate bias port and is turned off at
0V. The RF bias network has been incorporated into
the design for ease of use and space
considerations.
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
MASW-004240-13170W
(SP4T)
Electrical Specifications @ T
AMB
= +25
o
C
Parameter
Frequency
Port 1
J1
Port 2
J2
J3
J4
J5
J2
J3
J4
J5
J2
J3
J4
J5
Stimulus
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
Minimum
Typical
2.5
2.5
2.5
2.5
Maximum
3.5dB
3.5dB
3.5dB
3.5dB
Insertion
Loss
10GHz
&
24GHz
J1
J1
J1
J1
40dB
40dB
40dB
40dB
50
50
50
50
14
14
14
14
Isolation
10GHz
&
24GHz
J1
J1
J1
J1
Input Return
Loss
10GHz
&
24GHz
J1
J1
J1
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
TYPICAL INSERTION LOSS
0.0
-0.5
-1.0
-10
-20
-30
-40
-50
-60
0
TYPICAL ISOLATION
Insertion Loss (dB)
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
0
5
10
15
20
25
30
Isolation (dB)
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (Ghz)
TYPICAL INPUT RETURN LOSS
0
-2
TYPICAL OUTPUT RETURN LOSS
0
-2
Output Return Loss (dB)
0
5
10
15
20
25
30
Input Return Loss (dB)
-4
-6
-8
-10
-12
-14
-16
-18
-20
-4
-6
-8
-10
-12
-14
-16
-18
-20
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
MASW-004240-13170W Schematic
Operation of the MASW-004240-13170W
Operation of the MASW-00420-13170W PIN diode switch is achieved by simultaneously applying a current of
+12mA DC to the bias port of the on arm and 0V to the remaining isolated off arms.
Driver Connections
Control Level ( DC Current ) at Port
B2
-12mA
0V
0V
0V
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
Condition of RF Output
J1-J2
Low Loss
Isolation
Isolation
Isolation
J1-J3
Isolation
Low Loss
Isolation
Isolation
J1-J4
Isolation
Isolation
Low Loss
Isolation
J1-J5
Isolation
Isolation
Isolation
Low Loss
B3
0V
-12mA
0V
0V
B4
0V
0V
-12mA
0V
B5
0V
0V
0V
-12mA
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
with Integrated Bias Network
V1
Chip Dimensions and Pad Locations
1,2,3
Dim
A
B
C
D
E
F
G
H
Chip Dimensions
Mils
Millimeters
Min.
Max
Min.
Max
132.0
134.0
3.350
3.400
128.5
129.0
3.270
3.280
4.0
6.0
0.102
0.152
67.0
71.0
0.170
0.180
14.5
15.0
0.370
0.380
43.3
43.7
1.100
1.110
28.3
28.7
0.720
0.730
9.5
10.0
0.245
0.255
Dim
J1
J2
J3
J4
J5
B2
B3
B4
B5
R.F. & DC ground
Bond Pad Centers
Mils
Millimeters
X
Y
X
Y
0
-57
0
-1.450
-57
-57
1.450
-1.450
57
57
1.450
1.450
-57
57
-1.450
1.450
-57
-57
-1.450
-0.145
-57
15
1.450
0.380
12
57
0.313
1.450
-12
57
-0.313
1.450
-57
15
-1.450
0.380
Notes:
1.
2.
3.
Backside metallization thickness is.01µM.
Hatched areas indicate backside ohmic gold contacts
Bond pad centers are referenced from chip center.
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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