is a solderable, flip-chip Aluminum Gallium Arsenide
(AlGaAs) PIN diode. It is fabricated with MOCVD grown
epitaxy using a process and design that optimizes
device to device uniformity and produces extremely low
parasitics. The diode exhibits an exceptionally low RC
product (0.1ps) and a 2-3 nS switching speed. The chips
are fully passivated with silicon nitride and have an
added BCB polymer layer for scratch protection. The
BCB protective coating prevents damage to the diode
junction area and anode air-bridge during handling and
assembly.
Applications
The ultra low capacitance of the MADP-000907-14020
allows for operation at millimeter wave frequencies for
RF switches and phase shifter applications. The diode is
designed to be used in pulsed or CW applications,
where single digit nS switching speed is required. The
low capacitance of the MADP-000907-14020 makes it
ideal for use in many microwave multi-throw switch
assemblies, where the series capacitance of each “off”
Notes:
1. Yellow areas indicate ohmic gold mounting pads
2. Pad finish is 0.2µm of gold over 4µm nickel.
DIM
A
B
C
D
E
F
Inches
MIN.
0.026
0.014
0.007
0.004
0.007
0.018
MAX.
0.027
0.015
0.008
0.005
0.0073
0.019
Millimeters
MIN.
0.660
0.343
0.165
0.109
0.173
0.462
MAX.
0.686
0.368
0.191
0.135
0.185
0.488
Absolute Maximum Ratings T
AMB
= +25°C
(unless otherwise specified)
Parameter
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF + DC)
C.W. Incident Power
Mounting Temperature
1
Absolute Maximum
45V
-55°C to +125°C
-55°C to +150°C
+175°C
100mW
+23 dBm
+280°C for 10 seconds
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
Electrical Specifications @ T
AMB
= +25°C
V3
Parameter
Total Capacitance
Symbol
C
T
Conditions
-10V,1MHz
Units
pF
Typ.
0.025
Max.
0.030
Series Resistance
R
S
V
F
I
R
T
RISE
T
FALL
+10mA, 1GHz
Ω
5.2
7.0
Forward Voltage
Reverse Leakage Current
1
Switching Speed
2
+10mA
V
1.33
1.45
V
R
= -45V
10GHz
nA
nS
——
2
50
——
Notes:
1.
2.
The max rated V
R
(-45V) is sourced and the resultant reverse leakage current, Ir, is measured to be
<50nA
Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series
mounted diode. Driver delay is not included.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
Typical RF Performance @ T
AMB
= +25°C
Insertion Loss vs. Frequency
V3
I. Loss @5mA
0.0
I. Loss @15mA
I. Loss @50mA
Insertion Loss (dB)
-0.2
-0.4
-0.6
-0.8
-1.0
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Frequency (GHz)
Return Loss vs. Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
-20.0
-22.0
-24.0
Return Loss (dB)
-26.0
-28.0
-30.0
-32.0
-34.0
-36.0
-38.0
-40.0
2
3
4
5
6
7
8
9
10
11
12
13
14
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
15
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
Typical RF Performance @ T
AMB
= +25°C
V3
Isolation vs. Frequency
4
Frequency (Hz)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-000907-14020
Solderable AlGaAs Flip Chip PIN
Device Installation Guidelines
Cleanliness
This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned
using approved industry standard practices and chemicals.
V3
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD
handling techniques should be used. These devices are rated Class 0, (0-199V) HBM per MIL-STD-883, method
3015.7 and should be handled in a static-free environment.
General Handling
The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy
The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side
down. It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately
1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure
times, > 30 minutes, temperatures must be kept below 200°C.
Eutectic Solder Die Attached
63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the
attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual
temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for
less than 10 seconds. See
Application Note
M538
for recommended soldering profile.
Circuit Pad Layout
0.013”
Ordering Information
Part Number
MADP-000907-14020W
MADP-000907-14020P
Packaging
Waffle Pack
Tape and Reel
0.008”
(2) PL
0.012”
(2) PL
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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