MMIC voltage variable absorptive attenuator. Typical
applications are for WLAN IEEE 802.11a+b/g,
WiMAX IEEE 802.16, and MIMO. Other applications
include test equipment requiring ultra fast switching
speed.
The MAAA2000G is fabricated using a 1.0 micro gate
length GaAs MESFET process. The process features
full chip passivation for increased performance and
reliability.
V
B
V
A
Ordering Information
Part Number
MAAA2000G
1. Die quantity varies.
Package
DIE
1
Electrical Specifications: 0/-5 Vdc, 50
,
-55°C to +85°C
Parameter
Insertion Loss
2
Test Conditions
DC - 1.0 GHz
DC - 2.0 GHz
DC - 12.0 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 12.0 GHz
DC - 2.0 GHz
DC - 2.0 GHz
2.0 - 12.0 GHz
10% to 90% RF, 90% to 10% RF
50% Control to 90% RF, 50% Control to 10% RF
In-band
0.5 - 4.0 GHz
0 to -0.2 V
-5 V
Units
dB
Min.
—
—
—
—
—
—
23
40
12
—
—
—
—
—
—
Typ.
—
—
—
—
—
—
—
—
—
7
10
20
15
—
50
Max.
1.2
1.4
1.5
1.5:1
1.5:1
1.8:1
—
—
—
—
—
—
—
9
100
VSWR
Relative Attenuation
(Matched)
(Reflective)
(Matched)
Trise, Tfall
Ton, Toff
Transients
Input 1 dB Compression
V
IN
Low
V
IN
High
2. Loss changes 0.00025 dB/°C (-55°C to +85°C.)
Ratio
dB
ns
ns
mV
dBm
µA
µA
1
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Typical Performance Curves @ 25°C
Insertion Loss
2.0
Rev. V4
Isolation
55
1.5
45
35
1.0
25
0.5
15
0.0
0
2
4
6
8
10
12
5
0
2
4
6
8
10
12
Frequency (GHz)
Frequency (GHz)
VSWR
1.8
Attenuation @ 2 GHz
50
1.6
40
30
1.4
20
VB Series
VA Shunt
Matched Attn. below 23.5 dB
1.2
10
1.0
0
0
2
4
6
8
10
12
-5
-4
-3
-2
-1
0
Frequency (GHz)
Gate Voltage
Attenuation @ 12 GHz
14
12
10
8
6
VB Series
VA Shunt
Absolute Maximum Ratings
3,4
Parameter
Control Voltage
Input RF Power
(500 MHz - 12 GHz)
Storage Temperature
Absolute Maximum
-8.5 V
DC
+34 dBm
-65°C to +175°C
+175°C
4
2
0
Operating Temperature
-5
-4
-3
-2
-1
0
Gate Voltage
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. M/A-COM Technology Solutions does not recommend
sustained operation near these survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Handling Procedures
Permanent damage to the MAAA2000G may occur if the following precautions are not adhered to:
A. Cleanliness - The MAAA2000G should be handled in a clean environment. DO NOT attempt to clean
assembly after the MAAA2000G is installed.
B. Static Sensitivity - All die handling equipment and personnel should be DC grounded.
C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAA2000G. Use
shielded signal and bias cables to minimize inductive pick-up.
D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port
should be allowed to “float”.
E. General Handling - It is recommended that the MAAA2000G chip be handled along the long side of the die
with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
Rev. V4
Mounting
The MAAA2000G is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be die-mounted
using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat
before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a
tool temperature of 265°C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be
approximately 290°C.
B. DO NOT expose the MAAA2000G to a temperature greater than 320°C for more than 20 seconds. No more
than 3 seconds of scrubbing should be required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place the MAAA2000G into position. A thin epoxy fillet should be
visible around the perimeter of the die.
B. Cure epoxy per manufacturer’s recommended schedule.
C. Electrically conductive epoxy is recommended but is not required.
Bonding
A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic bonding with a nominal stage
temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to
achieve reliable wirebonds.
B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as
possible; at least three and no more than four bond wires from ground pads to package are recommended.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Rev. V4
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit
www.macom.com
for additional data sheets and product information.
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