TN1037
Technical note
SLLIMM™- nano mounting instructions and heatsink
By Agatino Minotti, Massimiliano Fiorito, Alessio Corsaro and Carmelo Parisi
Introduction
SLLIMM™-nano (Small Low-Losses Intelligent Molded Module) is a very compact, high
efficiency, dual-in-line intelligent power module with optional extra features for motor drive
applications. Thanks to its high electrical performance and very compact size, the fully
isolated SLLIMM-nano package (NDIP) is the ideal solution for applications requiring
reduced assembly space, without sacrificing thermal performance and reliability.
This technical note provides the main recommendations to properly handle, assemble and
rework the SLLIMM-nano devices in addition to some guidelines to improve its thermal
management. Some basic mounting instructions are suggested either to limit thermal and
mechanical stresses or assure the best thermal conduction and electrical insulation.
Figure 1. SLLIMM-nano images
Pin 26
Pin 16
Pin 1
Pin 17
AM17195v1
August 2013
DocID024655 Rev 3
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Contents
TN1037
Contents
1
Heatsink mounting information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
1.3
Main specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal conductive media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Safe distances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Cooling techniques and heatsink mounting proposals . . . . . . . . . . . . 7
2.1
2.2
2.3
2.4
2.5
Copper plate on the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Heatsink pasted on the package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Heatsink bonded on the PCB by mounting screws . . . . . . . . . . . . . . . . . . 9
Heatsink bonded on the package by plastic screws . . . . . . . . . . . . . . . . . 10
Al-plate heatsink bonded on the PCB by mounting screws . . . . . . . . . . . .11
3
General handling precautions and storage notices . . . . . . . . . . . . . . . 13
3.1
3.2
3.3
3.4
3.5
Transportation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Packaging specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1
4.2
4.3
4.4
Selective wave soldering of SLLIMM-nano . . . . . . . . . . . . . . . . . . . . . . . 17
Other soldering techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Pin-in-paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Heatsink mounting by reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1
5.2
5.3
5.4
Device removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Site redressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Reassembly and reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Coating of assembled PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
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Contents
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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Heatsink mounting information
TN1037
1
Heatsink mounting information
Although the SLLIMM-nano is designed to drive electric motors up to 100 W in open air, an
external heatsink can be mounted to improve its thermal performance.
This section provides some basic guidelines and the main specifications for ensuring safe
heatsink mounting, preventing the application of excessive force to the device and taking
into account the following suggestions:
•
Avoid applying excessive pressure to the SLLIMM-nano, as it could damage the module
and cause saturation of thermal dissipation capability
•
Smooth the surface by removing burrs and protrusions of indentations to ensure good
contact between the SLLIMM-nano and the heatsink
•
Do not touch the heatsink when the application is running to avoid burn injury
1.1
Main specifications
Table 1
provides the main parameters to be used during the heatsink mounting process.
Table 1. Mounting force and heatsink flatness specifications
Item
Device flatness
Condition
See
Figure 2
See
Figure 3
Force applied to leads standoff (see
Mounting force
(compression)
Min.
0
Typ.
Max.
+75
Unit
μm
μm
N
Heatsink flatness
-50
20
30
+100
40
Figure 4)
Force applied to plastic body (see
Figure 5)
Mounting torque
(M3 screw)
60
70
80
N
0.40
0.55
0.70
Nm
Device and heatsink flatness are prescribed as seen in
Figure 2
and
Figure 3.
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TN1037
Heatsink mounting information
Figure 2. Device flatness specification
PIN 26
PIN 17
+
PIN 1
PIN 16
Plane
to contact
the heat
sink
+
Plane
to contact
the heat
sink
PIN 1
PIN 16
Figure 3. Heatsink flatness specification
DocID024655 Rev 3
(+)
Plane to place
thermal media
(-)
(-)
(+)
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