GBU602 THRU GBU610
GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 200 to 1000 Volts
Forward Current - 6.0 Amperes
GBU
0.878 (22.30)
0.854 (21.70)
0.118 (3.0) x 45
CHAMFER
O
0.146 (3.70)
0.130 (3.30)
FEATURES
* Glass passivated chip junctions
*
Compliance to RoHS product
0.740 (18.80)
0.209 (5.30)
0.311 (7.20)
0.268 (6.80)
0.717 (18.20)
0.224 (5.70)
0.142 (3.6)
* Plastic Material has Underwriters Laboratory Flammability
Classification 94V-0
* High surge current capability
0.103 (2.61)
0.087 (2.21)
0.728 (18.50)
0.689 (17.50)
0.098 (2.50)
0.059 (1.50)
0.053 (1.34)
0.037 (0.94)
0.047 (1.20)
0.031 (0.80)
* Ideal for Printed Circuit Boards
* High temperature soldering guaranteed : 260 C/10 seconds
o
0.028 (0.70)
0.012 (0.30)
0.208(5.28) 0.208(5.28) 0.208(5.28)
0.192(4.88) 0.192(4.88) 0.192(4.88)
MECHANICAL DATA
Case : Molded Plastic
Polarity shown on front side of case, positive lead by beveled corner
Terminals :
Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity : As marked on Body
Weight : 4.0 grams (approx)
*Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature
SYMBOLS
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward
rectified current )T
c
=100 C (NOTE1,2)
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0 A
o
o
o
GBU602
200
140
200
GBU604
400
280
400
GBU606
600
420
600
GBU608
800
560
800
GBU610
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
V
RRM
V
RMS
V
DC
I
(AV)
6.0
I
FSM
175
Amps
V
F
1.0
Volts
Maximum DC reverse current
at rated DC blocking voltage
@T
A
=25 C
@T
A
=125 C
o
5
I
R
500
50
7.4
2.2
-55 to +150
o
uA
Typical Junction Capacitance per element (NOTE 4)
Typical thermal resistance per leg (NOTE 3)
C
J
R
R
JA
JC
pF
C/W
o
Operating junctionStorage temperature range
T
J,
T
STG
C
NOTES : (1) Unit case mounted on Al plate heat-sink
(2) Unit mounted on P.C.B. without heat-sink
(3) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for
maximum heat transfer with #6 screw heat-sink size : 6.35 x 3.5 x 0.15cm)
(4) Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
REV. 0
Zowie Technology Corporation
RATINGS AND CHARACTERISTIC CURVES GBU602 THRU GBU610
FIG.1 - FORWARD CURRENT DERATING CURVE
8.0
PEAK FORWARD SURGE CURRENT,
AMPERES
AVERAGE FORWARD RECTIFIED
CURRENT, AMPERES
200
175
150
125
100
75
50
25
0
0
25
50
75
100
o
FIG.2 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
Pulse Width 8.3ms
Single Half-Sire-Wave
(JEDEC Method)
6.0
4.0
HEAT-SINK MOUNTED
2.6 x 1.4 x 0.06" thick
(6.5 x 3.5 x 0.15 cm)
Al. PLATE
2.0
60 Hz Resistive or Inductive load
0
125
150
CASE TEMPERATURE, C
1
10
NUMBER OF CYCLES AT 60Hz
100
FIG.3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
100.0
500
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
100
IINSTANTANEOUS FORWARD CURRENT,
AMPERES
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
10.0
TJ=125 C
o
10
1.0
1.0
0.1
0.10
TJ=25 C
o
TJ=25 C
o
PULSE WIDTH=300uS
1% DUTY Cycle
GBU602 & GBU604
GBU606 ~ GBU610
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE,%
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG.5 - TYPICAL JUNCTION CAPACITANCE
200
T
J
=25 C
FIG.6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
100
TRANSIENT THERMAL IMPEDANCE,
o
C/W
o
JUNCTION CAPACITANCE, pF
100
60
40
20
10
6
4
2
1
.1
.2
.4
1.0
2
4
10
20
40
100
REVERSE VOLTAGE, VOLTS
10
1
0.1
0.01
0.1
1.0
t, HEATING TIME, sec.
10
100
REV. 0
Zowie Technology Corporation
微控制器 MCU
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