DC-DC Regulated Power Supply Module, 2 Output, 1W, Hybrid, ROHS COMPLIANT, DIP-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | ROHS COMPLIANT, DIP-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | -12V ADDITIONAL OUTPUT AVAILABLE |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 26.4 V |
| 最小输入电压 | 21.6 V |
| 标称输入电压 | 24 V |
| JESD-30 代码 | R-XDMA-T6 |
| JESD-609代码 | e3 |
| 最大负载调整率 | 10% |
| 功能数量 | 1 |
| 输出次数 | 2 |
| 端子数量 | 6 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 最大输出电流 | 0.042 A |
| 标称输出电压 | 12 V |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装等效代码 | DIP6/14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN OVER NICKEL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最大总功率输出 | 1 W |
| 微调/可调输出 | NO |
| NMV2412DC | NMV4815DAC | NMV4805DAC | NMV4812DC | NMV4812SC | |
|---|---|---|---|---|---|
| 描述 | DC-DC Regulated Power Supply Module, 2 Output, 1W, Hybrid, ROHS COMPLIANT, DIP-14 | DC-DC Regulated Power Supply Module, 1 Output, 1W, Hybrid, ROHS COMPLIANT, DIP-14 | DC-DC Regulated Power Supply Module, 1 Output, 1W, Hybrid, ROHS COMPLIANT, DIP-14 | DC-DC Regulated Power Supply Module, 2 Output, 1W, Hybrid, ROHS COMPLIANT, DIP-14 | DC-DC Regulated Power Supply Module, 2 Output, 1W, Hybrid, ROHS COMPLIANT, SIP-7 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | MODULE |
| 包装说明 | ROHS COMPLIANT, DIP-14 | DIP, DIP5/14,.3 | DIP, DIP5/14,.3 | ROHS COMPLIANT, DIP-14 | ROHS COMPLIANT, SIP-7 |
| 针数 | 14 | 14 | 14 | 14 | 7 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 26.4 V | 52.8 V | 52.8 V | 52.8 V | 52.8 V |
| 最小输入电压 | 21.6 V | 43.2 V | 43.2 V | 43.2 V | 43.2 V |
| 标称输入电压 | 24 V | 48 V | 48 V | 48 V | 48 V |
| JESD-30 代码 | R-XDMA-T6 | R-XDMA-T5 | R-XDMA-T5 | R-XDMA-T6 | R-XSMA-T5 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 最大负载调整率 | 10% | 10% | 15% | 10% | 10% |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 2 | 1 | 1 | 2 | 2 |
| 端子数量 | 6 | 5 | 5 | 6 | 5 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最大输出电流 | 0.042 A | 0.067 A | 0.2 A | 0.042 A | 0.042 A |
| 标称输出电压 | 12 V | 15 V | 5 V | 12 V | 12 V |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装等效代码 | DIP6/14,.3 | DIP5/14,.3 | DIP5/14,.3 | DIP6/14,.3 | SIP5/7,.18 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | SINGLE |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大总功率输出 | 1 W | 1 W | 1 W | 1 W | 1 W |
| 微调/可调输出 | NO | NO | NO | NO | NO |
| 其他特性 | -12V ADDITIONAL OUTPUT AVAILABLE | - | - | -12V ADDITIONAL OUTPUT AVAILABLE | -12V ADDITIONAL OUTPUT AVAILABLE |
| 封装代码 | DIP | DIP | DIP | DIP | - |
| 端子面层 | MATTE TIN OVER NICKEL | - | - | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL |
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