MMBD4448W
SURFACE MOUNT FAST SWITCHING DIODE
Features
•
•
•
•
•
Fast Switching Speed
Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 1, 2 and 3)
Mechanical Data
•
•
•
•
•
•
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.006 grams (approximate)
SOT-323
Top View
Top View
Internal Schematic
Ordering Information
(Notes 3 & 4)
Part Number
MMBD4448W-7-F
Notes:
Case
SOT-323
Packaging
3000/Tape & Reel
1. No purposefully added lead. Halogen and Antimony Free.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. Product manufactured with Green Molding Compound and does not contain Halogens or Sb
2
O
3
Fire Retardants.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
KA3
KA3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
Date Code Key
Year
2002
Code
N
Month
Code
Jan
1
2003
P
Feb
2
2004
R
Mar
3
2005
S
2006
T
Apr
4
YM
2007
U
May
5
2008
V
Jun
6
2009
W
Jul
7
2010
X
Aug
8
2011
Y
Sep
9
2012
Z
2013
A
Oct
O
2014
B
Nov
N
2015
C
Dec
D
MMBD4448W
Document number: DS30095 Rev. 12 - 2
1 of 4
www.diodes.com
February 2011
© Diodes Incorporated
MMBD4448W
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 4)
Average Rectified Output Current (Note 4)
Non-Repetitive Peak Forward Surge Current
Symbol
V
RM
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
O
@ t = 1.0μs
@ t = 1.0s
I
FSM
Value
100
75
53
500
250
4.0
1.0
Unit
V
V
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J,
T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Symbol
V
(BR)R
V
F
Min
75
0.62
⎯
⎯
⎯
⎯
⎯
⎯
Max
⎯
0.72
0.855
1.0
1.25
1.0
50
30
25
2.0
4.0
Unit
V
V
μA
μA
μA
nA
pF
ns
Test Condition
I
R
= 10μA
I
F
= 5.0mA
I
F
= 10mA
I
F
= 100mA
I
F
= 150mA
V
R
= 75V
V
R
= 75V, T
J
= 150°C
V
R
= 25V, T
J
= 150°C
V
R
= 20V
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100Ω
Reverse Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes:
I
R
C
T
t
rr
4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
200
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
0
40
80
160
120
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 1 Power Derating Curve
200
250
1,000
P
D
, POWER DISSIPATION (mW)
100
150
10
100
50
1
0
0.1
0
0.4
0.8
1.2
1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
MMBD4448W
Document number: DS30095 Rev. 12 - 2
2 of 4
www.diodes.com
February 2011
© Diodes Incorporated
MMBD4448W
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
10,000
3.0
f = 1MHz
1,000
C
T
, TOTAL CAPACITANCE (pF)
2.5
2.0
100
1.5
10
1.0
1
0.5
0.1
0
0
20
40
60
80
100
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
0
10
20
30
40
V
R
, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
Package Outline Dimensions
A
B C
G
H
K
M
J
D
L
SOT-323
Dim
Min
Max
Typ
A
0.25
0.40
0.30
B
1.15
1.35
1.30
C
2.00
2.20
2.10
D
-
-
0.65
G
1.20
1.40
1.30
H
1.80
2.20
2.15
J
0.0
0.10
0.05
K
0.90
1.00
1.00
L
0.25
0.40
0.30
M
0.10
0.18
0.11
0°
8°
-
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
Dimensions Value (in mm)
Z
2.8
X
0.7
Y
0.9
C
1.9
E
1.0
X
E
MMBD4448W
Document number: DS30095 Rev. 12 - 2
3 of 4
www.diodes.com
February 2011
© Diodes Incorporated
MMBD4448W
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
MMBD4448W
Document number: DS30095 Rev. 12 - 2
4 of 4
www.diodes.com
February 2011
© Diodes Incorporated
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