UNISONIC TECHNOLOGIES CO., LTD
US12231
Preliminary
CMOS IC
EXPRESSCARD
TM
POWER
INTERFACE SWITCH
DESCRIPTION
The UTC
US12231
ExpressCard
TM
power interface switches
are designed to meet the ExpressCard
TM
specification. The UTC
US12231
distribute 3.3V, AUX, and 1.5V to the single-slot
ExpressCard|34 or ExpressCard|54 sockets. Each voltage rail is
protected with integrated current-limiting circuitry, other functions
include thermal protection circuit turns off switches to prevent
device from damage when heavy overloads or short circuits,
The UTC
US12231
can use in notebook computers, desktop
computers, PDAs, and digital cameras.
TSSOP-20
FEATURES
*
Meets the ExpressCard
TM
standard (ExpressCard|34 or
ExpressCard|54)
* Compliant with the ExpressCard
TM
compliance checklists
* Fully satisfies the ExpressCard
TM
implementation guidelines
* Supports systems with WAKE function
* TTL-Logic compatible inputs
* Short circuit and thermal protection
* -40°C ~ 85°C ambient operating temperature range
ORDERING INFORMATION
Ordering Number
Lead Free
US12231L-P20-T
US12231L-P20-R
Halogen Free
US12231G-P20-T
US12231G-P20-R
Package
TSSOP-20
TSSOP-20
Packing
Tube
Tape Reel
※
ExpressCard is a trademark of Personal Computer Memory Card International Association.
www.unisonic.com.tw
Copyright © 2014 Unisonic Technologies Co., Ltd
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US12231
MARKING INFORMATION
PACKAGE
Preliminary
CMOS IC
MARKING
TSSOP-20
PIN CONFIGURATION
PIN DESCRIPTION
PIN NAME
SYSRST
SHDN
STBY
3.3V
IN
3.3V
OUT
PERST
NC
GND
CPUSB
CPPE
1.5V
OUT
1.5V
IN
AUX
OUT
AUX
IN
RCLKEN
OC
I
I
O
I
O
I
I/O
O
I/O
I
I
I
I
O
O
DESCRIPTION
System Reset input – active low, logic level signal. Internally pulled up to
AUXIN.
Shutdown input – active low, logic level signal. Internally pulled up to AUXIN.
Standby input – active low, logic level signal. Internally pulled up to AUXIN.
3.3-V input for 3.3VOUT
Switched output that delivers 0 V, 3.3 V or high impedance to card
A logic level power good to slot 0 (with delay)
No connection
Ground
Card Present input for USB cards. Internally pulled up to AUXIN.
TM
Card Present input for PCI Expresscards . Internally pulled up to AUXIN
PIN NO.
1
2
3
4, 5
6, 7
8
9
10
11
12
13, 14
15,16
17
18
19
20
Switched output that delivers 0 V, 1.5 V or high impedance to card
1.5-V input for 1.5VOUT
Switched output that delivers 0 V, AUX or high impedance to card
AUX input for AUXOUT and chip power
Reference Clock Enable signal. As an output, a logic level power good to host
for slot 0 (no delay – open drain). As an input, if kept inactive (low) by the host,
prevents PERST from being de-asserted. Internally pulled up to AUXIN.
Overcurrent status output for slot 0 (open drain)
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US12231
BLOCK DIAGRAM
Preliminary
CMOS IC
3.3V
IN
4/5
UVLO
AUX
IN
18
UVLO
1.5V
IN
15/
16
Current
Limit
Current
Limit
Current
Limit
S1
6/7
3.3V
OUT
S4
17
S2
AUX
OUT
S5
13/
14
S3
1.5V
OUT
UVLO
S6
PG
CPUSB
11
20
OC
CPPE
12
Control
Logic
STBY
3
19
Thermal
Shutdown
AUXIN
RCLKEN
SHDN
2
AUXIN
Delay
GND
10
8
1
PERST
SYSRST
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US12231
PARAMETER
Input Voltage Range For Card Power
Logic Input/Output Voltage
Output Voltage Range
Continuous Total Power Dissipation
Output Current
OC Sink Current
PERST Sink/Source Current
Preliminary
CMOS IC
ABSOLUTE MAXIMUM RATING
(Over operating free-air temperature range (unless otherwise noted)
SYMBOL
V
IN
TEST CONDITIONS
1.5V
IN
3.3V
IN
AUX
IN
1.5V
IN
3.3V
IN
AUX
IN
1.5V
IN
3.3V
IN
AUX
IN
RATINGS
UNIT
-0.3~6
-0.3~6
V
-0.3~6
-0.3~6
V
-0.3~6
-0.3~6
V
-0.3~6
See dissipation rating table
Internally limited
Internally limited
Internally limited
10
10
mA
mA
°C
°C
V
OUT
I
OUT
Operating Virtual Junction Temperature Range
T
J
-40~+120
Storage Temperature Range
T
STG
-55~+150
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
DISSIPATION RATINGS
(Thermal Resistance=°C/W)
PARAMETER
SYMBOL
RATINGS
UNIT
POWER RATING (T
A
≤25°C)
704.2
mW
Note: These devices are mounted on a JEDEC low-k board (2-oz. traces on surface), (The table is assuming that
the maximum junction temperature is 120°C).
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
1.5V
IN
TEST CONDITIONS
1.5V
IN
is only required for its
respective functions
3.3V
IN
is only required for its
respective functions
AUX
IN
is required for all circuit
operations
MIN
1.35
3
3
0
0
0
-40
TYP
MAX
1.65
3.6
3.6
650
1.3
275
120
mA
A
mA
°C
V
UNIT
Input Voltage
V
IN
3.3V
IN
AUX
IN
1.5V
OUT
3.3V
OUT
AUX
OUT
Continuous Output Current
Operating Virtual Junction
Temperature
I
OUT
T
J
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ELECTRICAL CHARACTERISTICS
Preliminary
CMOS IC
T
J
=25°C, V
I(3.3VIN)
=V
I(AUXIN)
=3.3V, V
I(1.5VIN)
=1.5V, V
I(/SHDNx)
, V
I(/STBYx)
=3.3V, V
I(/CPPEx)
=V
I(/CPUSBx)
=0V, V
I(/SYSRST)
=3.3V,
OCx
and
RCLKENx and
PERSTx
are open, all voltage outputs unloaded (unless otherwise noted)
PARAMETER
1.5V
IN
~1.5V
OUT
Power Switch Resistance
3.3V
IN
~3.3V
OUT
AUX
IN
~AUX
OUT
Discharge Resistance On 3.3V/1.5V/AUX Outputs
1.5V
OUT
Short
-Circuit Output Current (Note
1)
Steady-State
Value
3.3V
OUT
AUX
OUT
T
J
T
J_OC
Hysteresis
From Short To The 1
Current
-Limit Response Time
Threshold Within
1.1Times Of Final
Current Limit, T
J
=25°C
1.5V
IN
Operation Input Quiescent
Current
Normal
Operation
3.3V
IN
AUX
IN
Normal
Operation
Total Input Quiescent Current
Shutdown
Mode
1.5V
IN
3.3V
IN
AUX
IN
1.5V
IN
I
I
I
I
st
SYMBOL
TEST CONDITIONS
T
J
=25°C, I=650mA each
T
J
=100°C, I=650mA each
T
J
=25°C, I=1300mA each
T
J
=100°C, I=1300mA each
T
J
=25°C, I=275mA each
T
J
=100°C, I=275mA each
MIN TYP MAX UNIT
46
70
45
68
120
200
100
0.67
1
2
450
165
130
10
°C
100
140
100
10
15
150
10
15
210
μA
μA
μs
43
100
38
2.5
10
85
2.5
10
120
500
1.3
2.5
600
mΩ
mΩ
mΩ
Ω
A
A
mA
R
DS
R
(DIS_FET)
V
I(/SHDNx)
=0V, I
(discharge)
=1mA
I
OS
T
J
(-40~120°C), Output powered into a
short
1.35
275
Rising temperature, not in overcurrent
condition
Overcurrent condition
V
O(3.3VOUT)
with 100-mΩ short
V
O(1.5VOUT)
with 100-mΩ short
V
O(AUXOUT)
with 100-mΩ short
Outputs are unloaded,
T
J
(–40, 120°C) (does not include
CPPEx
and
CPUSBx
logic pullup currents)
Outputs are unloaded,
T
J
(–40, 120°C) (include
CPPEx
and
CPUSBx
logic pullup currents)
Thermal
Shutdown
Trip Point, T
J
155
120
°C
∆T
CPUSB =
CPPE
=0V,
SHDN
=0V
(discharge FETs are on) (include
CPPEx
and
CPUSBx
logic pullup
currents and
SHDN
pullup current) T
J
(–40, 120°C)
SHDN
=3.3V,
CPUSB
=
CPPE
= 3.3V
0.5
3.5
144
0.1
0.1
20
0.1
10
10
270
50
50
50
10
50
10
50
10
50
μA
μA
μA
μA
μA
3.3V
IN
AUX
IN
1.5V
IN
(no card present, discharge FETs are on),
I
lkg(FWD)
current measured at input pins,
T
J
=120°C, includes RCLKEN pullup
current
V
O(AUXOUT)
=V
O(3.3VOUT)
=3.3V,
I
lkg(RVS)
V
O(1.5VOUT)
=1.5V, All voltage inputs are
grounded (current measured from output
pins going in)
0.1
0.1
Forward Leakage Current
3.3V
IN
AUX
IN
T
J
=25°C
T
J
=120°C
T
J
=25°C
T
J
=120°C
T
J
=25°C
T
J
=120°C
1.5V
IN
3.3V
IN
AUX
IN
Reverse Leakage Current
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