RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Features:
•
•
•
•
•
•
Higher power ratings than standard thick film chips
Absolute TCRs to ±100ppm/°C
Impervious to Sulfur contamination, no silver present in
terminations
Absolute Tolerances to 1%
Completely lead free and RoHS compliant without
exemptions – does not use lead containing glass
Comparable in cost to standard thick film chip resistors
Stackpole Electronics, Inc.
Resistive Product Solutions
Electrical Specifications
Type / Code
RNCP0402
RNCP0603
Package
Type
0402
0603
Power Rating(2)
(Watts) @ 70ºC
0.1W
0.125W
Maximum Working
Voltage(1)
50V
150V
Maximum Overload
Voltage
100V
300V
Resistance
Temperature
Coefficient
±100 ppm/ºC
±100 ppm/ºC
±100 ppm/ºC
±100 ppm/ºC
Ohmic Range (Ω) and
Tolerance
1%, 2%, 5%
1 - 10K
1 - 47K
1 - 100K
1 - 100K
RNCP0805
0805
0.25W
200V
400V
200V
400V
RNCP1206
1206
0.5W
(1) Lesser of
√PR
or maximum working voltage.
(2) Power rating for each package size is valid if ambient temp
≤80°C
and terminal temp
≤105°C.
Please refer to the High Power Resistor Application Note (page 4) for more information on designing and
implementing high power resistor types.
Performance Characteristics
Test
Short Time Overload
Thermal Shock
Test Conditions
RCWV * 2.5 or Max Overload Voltage, 5 seconds
MIL-STD-202F Method 107G
-55°C to +125°C, 1000 Cycles
MIL-STD-202F Method 108A
RCWV, 125°C, 1.5 Hrs ON, 0.5 Hrs OFF, Total 1000 Hrs
MIL-STD-202F Method 103B
85°C, 85% RH, RCWV 1.5Hrs ON, 0.5Hrs OFF, Total 1000Hrs
MIL-STD-202F Method 210E
260 ± 5°C, 10 ± 1 second
Typical
1%
± 1%
± 1%
2%, 5%
± 2%
± 1%
Load Life
± 2%
± 3%
Humidity (steady state)
± 3%
± 3%
Resistance to Soldering Heat
± 1%
± 1%
* Storage Temperature : 25 ± 3°C; Humidity < 80% RH
Operating Temperature Range: -55ºC to +70ºC. Above 70ºC, the part should be derated linearly to zero power at 155ºC.
Rev Date: 03/24/2011
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
1
www.seielect.com
marketing@seielect.com
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors,
which have had higher power ratings than standard resistor chips. This has caused some uncertainty and
even confusion by users as to how to reliably use these resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated
power assumes an ambient temperature of no more than 100 degrees C for the CSS / CSSH series and 70
degrees C for all other high power resistor series. In addition, IPC and UL best practices dictate that the
combined temperature on any resistor due to power dissipated and ambient air shall be no more than 105C.
At first glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR
½ 100 milliohm at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with
its unique materials, design, and processes would have less heat rise and therefore would be easier to
implement for any given customer.
The 102 degrees C heat rise shown here would indicate there will be additional thermal reduction techniques
needed to keep this part under 105C total hot spot temperature if this part is to be used at 0.75 watts of
power. However, this same part at the usual power rating for this size would have a heat rise of around 72
degrees C. This additional heat rise may be dealt with using wider conductor traces, larger solder pads and
land patterns under the solder mask, heavier copper in the conductors, vias through PCB, air movement, and
heat sinks, among many other techniques. Because of the variety of methods customers can use to lower
the effective heat rise of the circuit, resistor manufacturers simply specify power ratings with the limitations
on ambient air temperature and total hot spot temperatures and leave the details of how to best accomplish
this to the design engineers. Design guidelines for products in various market segments can vary widely so it
would be unnecessarily constraining for a resistor manufacturer to recommend the use of any of these
methods over another.
Note:
The final resistance value can be affected by the board layout and assembly process, especially the size of the
mounting pads and the amount of solder used. This is especially notable for resistance values
≤
50 mΩ.
This should be taken into account when designing.
Rev Date: 03/24/2011
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
4
www.seielect.com
marketing@seielect.com
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