Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSC0924NDI
MA001013784
PG-TISON-8-2
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.495
0.010
0.041
0.822
33.360
0.062
0.096
4.933
42.860
1.122
0.186
0.021
0.017
0.805
0.003
0.014
0.279
11.312
Average
Mass
[%]
0.51
0.01
0.04
0.85
34.59
0.06
0.10
5.11
44.48
1.16
0.19
0.02
0.02
0.83
0.00
0.01
0.29
11.73
28. July 2015
96.44 mg
Sum
[%]
0.51
Average
Mass
[ppm]
5132
106
426
8520
35.49
0.06
345930
641
993
51148
49.69
1.16
0.19
444442
11633
1926
218
175
0.87
8344
36
144
2889
12.03
117297
120366
1000000
8737
496583
11633
1926
354982
641
Sum
[ppm]
5132
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
leadfinish
plating
solder
heat sink CLIP
*deviation
< 10%
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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