Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE9877QXA40
MA001346760
PG-VQFN-48-31
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.821
0.018
0.072
1.433
58.193
0.619
0.181
7.668
52.531
2.629
0.614
0.280
0.937
Average
Mass
[%]
3.71
0.01
0.06
1.10
44.76
0.48
0.14
5.90
40.41
2.02
0.47
0.22
0.72
28. June 2015
130.00 mg
Sum
[%]
3.71
Average
Mass
[ppm]
37084
138
551
11025
45.93
0.48
447655
4764
1393
58989
46.45
2.02
0.47
404096
20223
4722
2153
0.94
7207
9360
1000000
464478
20223
4722
459369
4764
Sum
[ppm]
37084
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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