Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE42994G
MA001302598
PG-DSO-8-16
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.995
0.009
0.036
0.717
29.121
0.158
0.095
4.371
43.045
0.824
0.650
0.313
1.108
Average
Mass
[%]
3.59
0.01
0.04
0.86
34.90
0.19
0.11
5.24
51.59
0.99
0.78
0.37
1.33
14. October 2015
83.44 mg
Sum
[%]
3.59
Average
Mass
[ppm]
35898
107
430
8595
35.81
0.19
348994
1891
1139
52384
56.94
0.99
0.78
515865
9875
7793
3746
1.70
13283
17029
1000000
569388
9875
7793
358126
1891
Sum
[ppm]
35898
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
