Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX4949SJ
MA000998440
PG-DSO-8-44
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.577
0.009
0.036
0.717
29.121
0.081
0.101
4.630
45.593
0.824
0.650
0.057
0.202
Average
Mass
[%]
0.70
0.01
0.04
0.87
35.26
0.10
0.12
5.61
55.19
1.00
0.79
0.07
0.24
17. April 2015
82.60 mg
Sum
[%]
0.70
Average
Mass
[ppm]
6986
109
434
8683
36.18
0.10
352562
980
1219
56052
60.92
1.00
0.79
551986
9976
7872
691
0.31
2450
3141
1000000
609257
9976
7872
361788
980
Sum
[ppm]
6986
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com